XCede® HD High-Density Backplane System

XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance & keying, and side walls for increased durability. Featuring a staggered differential pin design, the ground pins mate first for hot-plugging to help prevent system downtime.

XCede® HD consists of signal, power and keying/guidance modules for incredible design flexibility. The modules can be customized in any configuration to meet specific application requirements.

How to build a full solution:

• Right-angle modules can be built into a single customizable BSP part. Build a BSP part by combining any number, in any configuration, of HDTFs, power and keying/guidance modules to create one receptacle.
• Header modules mount to the backplane individually, in any configuration of HDTM and HPTS parts.
• Build Your Custom XCede® HD Solution
• Contact HSBP@samtec.com for more information about building a full XCede® HD solution.

• Small form factor provides significant space savings

• Modular design provides flexibility in applications

• High-density backplane system – up to 84 differential pairs per linear inch

• 1.80 mm column pitch

• 3-, 4- and 6-pair designs

• 4, 6 or 8 columns

• 12–48 pairs

• Up to a 3.00 mm contact wipe on signal pins

• Multiple signal/ground pin staging options

• Integrated power, guidance, keying and side walls available

• 85 Ω and 100 Ω options

• Three levels of sequencing enable hot plugging

• Cost-effective designs available for low-speed applications