High-Density Arrays

128 Gbps PAM4 per channel

PCIe® 7.0 capable

4.0 Tbps aggregate data rate - 9 IEEE 400G channels

Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control

Two points of contact ensure a more reliable connection

92 Ω solution addresses both 85 Ω and 100 Ω applications

Analog Over Array™ capable

0.635 mm pitch open-pin-field array

56 Gbps NRZ/112 Gbps PAM4 performance

Cost optimized solution

Low-profile 5 mm and up to 10 mm stack heights

Up to 400 total pins available; roadmap to 1,000+ pins

Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE

Analog Over Array™ capable

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Incredibly dense with up to 400 total I/Os

Low profile 5 mm to 16 mm stack heights

Slim 5 mm width

4-row design; 10 - 100 positions per row

Edge Rate® contact system optimized for signal integrity performance

Open-pin-field design for grounding and routing flexibility

Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

PCIe® 6.0/CXL® 3.2 capable

Right-angle and cable in development

SureWare™ ultra rugged guide post standoffs available (GPSO)

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Best in class density for power and signal

Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding

Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

PCIe® 6.0/CXL® 3.2 capable

Open-pin-field design for grounding and routing flexibility

High-density multi-row design

Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap

4 or 8 total power blades; up to 10 in development

60 or 240 total signal positions; additional position counts in development

0.635 mm signal pitch

Optional alignment pins

Standard weld tabs for a secure connection to the board

Polarized guide posts for blind mating

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High-density mezzanine arrays feature 64 differential pairs per square inch

Mezzanine arrays route an extremely high number of transmission lines from one PCB to the next

Surface mount reflow technology to the PCB

High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems

PCIe® 7.0 capable

CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCM, SFCC, Optics)

Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)

Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew

Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications

Contact HDR@samtec.com for more information

Maximum routing and grounding flexibility

Lower insertion/extraction forces vs. typical array products

56 Gbps PAM4 performance

Up to 560 I/Os in open pin field design

1.27 mm (.050") pitch

Rugged Edge Rate® contact system

Can be “zippered” during mating/unmating

Solder charge terminations for ease of processing

Meets Extended Life Product™ (E.L.P.™) standards

Analog Over Array™ capable

7–18.5 mm stack heights

Vertical, right-angle, press-fit

Elevated systems to 40 mm

85 Ω systems

Standards: VITA™ 47, VITA™ 57.1 FMC™, VITA™ 57.4 FMC+™, VITA™ 74 VNX™, PISMO™ 2

IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)

IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)

0.80 mm (.0315") pitch grid

50% board space savings versus .050" (1.27 mm) pitch arrays

28 Gbps NRZ/56 Gbps PAM4 performance

Rugged Edge Rate® contact system

Up to 500 I/Os

7 mm and 10 mm stack heights

Solder charge terminations for ease of processing

Final Inch® certified for Break Out Region trace routing recommendations

Analog Over Array™ capable

4 mm, 4.5 mm, 5 mm stack heights

Up to 400 I/Os

4, 6 and 8 row designs

.050" (1.27 mm) pitch

Dual beam contact system

Solder crimp termination for ease of processing

56 Gbps PAM4 performance

Analog Over Array™ capable

1.27 mm standard body height

1.00 mm pitch

Dual compression contacts

100 – 300 total pins

Ideal for low cost board stacking, module-to-board and LGA interfaces

Minimizes thermal expansion issues

Analog Over Array™ capable

Application specific capability to stack heights from 20 mm to 35 mm

Open pin field design

Performance: Up to 9 GHz / 18 Gbps

Integrated guide posts to minimize contact damage when mating and unmating

Solder charge terminations for ease of processing

2.00 mm x 1.20 mm pitch

Up to 299 I/Os

Intermateable with Molex HD Mezz Arrays

HD Mezz is a trademark of Molex Incorporated

Passed 10 year Mixed Flowing Gas (MFG)

High-mating cycles (250 to 2,500)

Variety of high-reliability, rugged contact systems

Various connector types and pitches available

Standoffs for 4 mm to 30 mm stack heights

Reduces risk for component damage on boards

SureWare™ guide post standoffs (GPSO) allow for 0.035" of initial misalignment and assist with "blind mate"

Standoffs designed for PCI/104-Express™ and VITA™ standards

Guidance modules for ExaMAX® backplane systems