AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.
0.635 mm pitch open-pin-field array
56 Gbps NRZ/112 Gbps PAM4 performance
Cost optimized solution
Low-profile 5 mm and up to 10 mm stack heights
Up to 800 total pins available; roadmap to 1,000+ pins
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
Analog Over Array™ capable
As data rates increase, trace length on PCBs decreases. Samtec's high-speed, Flyover® cable assemblies simplify PCB design and limit signal degradation in high data rate applications. The AcceleRate® HP Flyover® SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the AcceleRate® HP High-Density, High-Performance Cable System. The AcceleRate® HP DP Flyover® SI Evaluation Kit REF-230038-X.XX-XX routes 8 differential pairs through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP SE Flyover® SI Evaluation Kit REF-231683-X.XX-XX routes 8 single-ended signals through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP Flyover® SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at KitsAndBoards@samtec.com for additional information.
Part Number: REF-231683-X.XX-XX
As data rates increase, trace length on PCBs decreases. Samtec's high-speed, Flyover® cable assemblies simplify PCB design and limit signal degradation in high data rate applications. The AcceleRate® HP Flyover® SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the AcceleRate® HP High-Density, High-Performance Cable System. The AcceleRate® HP DP Flyover® SI Evaluation Kit REF-230038-X.XX-XX routes 8 differential pairs through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP SE Flyover® SI Evaluation Kit REF-231683-X.XX-XX routes 8 single-ended signals through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series. The AcceleRate® HP Flyover® SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at KitsAndBoards@samtec.com for additional information.
Part Number: REF-230038-X.XX-XX
Samtec 0.635 mm pitch, 112 Gbps PAM4 AcceleRate® HP high-performance arrays support high-performance applications with maximum routing and grounding flexibility via an open-pin-field design. The AcceleRate® HP SI Evaluation Kit (REF-218313-X.XX-XXX) provides system designers and SI engineers an easy-to-use solution for testing AcceleRate® HP connectors. The AcceleRate® HP SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec's technical experts at KitsandBoards@samtec.com for additional information.
Part Number: REF-218313-X.XX-XXX
56 Gbps NRZ/112 Gbps PAM4 performance
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
Up to 800 total pins available; roadmap to 1,000+ pins
Open-pin-field design for maximum grounding and routing flexibility
Low-profile 5 mm and up to 10 mm stack heights
Current rating: 1.2 A max
Voltage rating: 150 VAC/212 VDC max
Analog Over Array™ capable
56 Gbps NRZ/112 Gbps PAM4 performance
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
Up to 800 total pins available; roadmap to 1,000+ pins
Open-pin-field design for maximum grounding and routing flexibility
Low-profile 5 mm and up to 10 mm stack heights
Current rating: 1.2 A max
Voltage rating: 150 VAC/212 VDC max
Analog Over Array™ capable
56 Gbps NRZ/112 Gbps PAM4 performance
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
4-row design; 10 - 100 positions per row
Open-pin-field design for maximum grounding and routing flexibility
Current rating: 1.2 A max
Voltage rating: 150 VAC/212 VDC max
Analog Over Array™ capable
Allows for 0.035" of initial misalignment; alignment starts before connectors engage
Assists with “blind mate” for ultra micro, fine pitch mezzanine connectors
4 mm - 30 mm stack heights
MIL-DTL stainless steel
Pairs well with NVAM/NVAF, APM6/APF6, ADM6/ADF6 and UMPT/UMPS
Accommodates blind mating in perpendicular applications
Mates with GPPK Series guide post
Use with PCB thickness of .062" (1.60 mm) to .125" (3.18 mm)
Pairs with most high-speed connector strips and arrays
Accommodates blind mating in perpendicular applications
Mates with GPSK guide post socket
Pairs with most high-speed connector strips and arrays
