Application specific capability to stack heights from 20 mm to 35 mm
Open pin field design
Performance: Up to 9 GHz / 18 Gbps
Integrated guide posts to minimize contact damage when mating and unmating
Solder charge terminations for ease of processing
2.00 mm x 1.20 mm pitch
Up to 299 I/Os
Intermateable with Molex HD Mezz Arrays
HD Mezz is a trademark of Molex Incorporated
Elevated HD Mezz high-density open pin field arrays up to 35 mm stack heights.
Features
Products
HDAF
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Socket
Features
HD Mezz is a trademark of Molex Incorporated
Up to 299 I/Os
Solder charge termination for ease of processing
Intermateable with Molex HD Mezz Arrays
Integrated guide posts to minimize contact damage when mating and unmating
2.00 mm x 1.20 mm pitch
Open pin field design
Application specific capability to build any height from 20 mm to 35 mm
Performance: Up to 9 GHz / 18 Gbps
Current rating: 1.8 A max
Voltage rating: 230 VAC/325 VDC max
HDAM
2.00 mm x 1.20 mm HD Mezz Rugged, High-Density Open-Pin-Field Array Terminal
Features
Solder charge termination for ease of processing
Up to 299 I/Os
HD Mezz is a trademark of Molex Incorporated
Intermateable with Molex HD Mezz Arrays
Integrated guide posts to minimize contact damage when mating and unmating
Performance: Up to 9 GHz / 18 Gbps
Current rating: 1.8 A max
Voltage rating: 230 VAC/325 VDC max
2.00 mm x 1.20 mm pitch
Open pin field design
Contact Sales
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