Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems

Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market.

Features

  • High-density mezzanine arrays feature 64 differential pairs per square inch

  • Mezzanine arrays route an extremely high number of transmission lines from one PCB to the next

  • Surface mount reflow technology to the PCB

  • High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems

  • PCIe® 7.0 capable

  • Co-packaged offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density

  • Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew

  • Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications

Downloads & Resources

Literature

High-Speed Cable Interconnect Solutions Guide

High-Speed Cable Interconnect Solutions Guide

Download PDF
Product Overview Guide

Product Overview Guide

Download PDF

Technical Documents

Products

SFBF

IN DEVELOPMENT - Si-Fly® HD Mezzanine Array Socket
Features
  • Designed to mate with Si-Fly® HD mezzanine terminal (SFBM)

  • 224 Gbps PAM4 performance

  • PCIe® 7.0 capable

  • 64 differential pairs per square inch

  • Routes an extremely high number of transmission lines from one PCB to the next

  • Surface mount reflow technology to the PCB

  • Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group

  • Operating temperatures supporting -55 °C to +125 °C


SFBM

IN DEVELOPMENT - Si-Fly® HD Mezzanine Array Terminal
Features
  • Designed to mate with Si-Fly® HD mezzanine socket (SFBF)

  • 224 Gbps PAM4 performance

  • PCIe® 7.0 capable

  • 64 differential pairs per square inch

  • Routes an extremely high number of transmission lines from one PCB to the next

  • Surface mount reflow technology to the PCB

  • Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group

  • Operating temperatures supporting -55 °C to +125 °C


SFCC

IN DEVELOPMENT - Si-Fly® HD Co-Packaged Cable Assembly
Features
  • 224 Gbps PAM4 performance

  • PCIe® 7.0 capable

  • 170 differential pairs per square inch

  • Co-packaged for efficient signal routing and high density from the chip

  • Extremely high transmission line density using a low profile 10 mm mated height (4 row configuration)

  • 8 differential pairs per row (4, 6 or 8 row configurations)

  • Eye Speed® Hyper Low Skew Twinax cable technology supports 224 Gbps PAM4 signaling (32 AWG)

  • Hyper low skew: 1.75 ps/meter max


SFCM

IN DEVELOPMENT - Si-Fly® HD Co-Packaged Substrate Connector
Features
  • Designed to mate with Si-Fly® HD co-packaged cable assembly (SFCC)

  • 224 Gbps PAM4 performance

  • PCIe® 7.0 capable

  • 170 differential pairs per square inch

  • Routes an extremely high number of transmission lines from the chip

  • Integrated mechanical retention features

  • Surface mount reflow technology to the substrate

  • Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group

  • Operating temperatures supporting -55 °C to +125 °C


SFNC

IN DEVELOPMENT - Si-Fly® HD Near-Chip Cable Assembly
Features

SFNM-L

IN DEVELOPMENT - Si-Fly® HD Near-Chip Board Connector
Features
  • Designed to mate with Si-Fly® HD near-chip cable assembly (SFNC)

  • 224 Gbps PAM4 performance

  • PCIe® 7.0 capable

  • 64 differential pairs per square inch

  • Launches an extremely high number of transmission lines adjacent to the chip package

  • Integrated mechanical retention features

  • Surface mount reflow technology to the PCB

  • Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group

  • Operating temperatures supporting -55 °C to +125 °C


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