Standoffs, Guide Posts & Ultra Rugged Hardware

Allows for 0.035" of initial misalignment; alignment starts before connectors engage

Assists with “blind mate” for ultra micro, fine pitch mezzanine connectors

4 mm - 30 mm stack heights

MIL-DTL stainless steel

Pairs well with NVAM/NVAF, APM6/APF6, ADM6/ADF6 and UMPT/UMPS

Lower profile version of GPSO

Assists with board alignment when blind mating

7 mm and 9 mm board stacks

MIL-DTL stainless steel

Pairs well with NVAM/NVAF, APM6/APF6, ADM6/ADF6, UDM6/UDF6 and UMPT/UMPS

Female thread/press-in and male/male thread

Board stacking stand off

Board stacks from 5.00 mm to 30.00 mm

Pairs well with QSH/QTH, QSE/QTE, QSS/QTS, QMS/QFS, QFSS/QMSS, QRF8/QRM8, ERF5/ERM5, ERF6/ERM6, ERF8/ERM8, LSHM, LSS, LSEM, SS4/ST4, SS5/ST5, SLH/TLH

Works as a traditional standoff

Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF, ADM6/ADF6 and other high-normal-force connectors

Reduces risk for component damage on boards

Board stacks from 4.00 mm to 16.00 mm

Press-fit and threaded bases available

For use with Q2™ connectors designed for PCI/104-Express™ applications: ASP-129637-03, ASP-129637-13, ASP-129646-03, ASP-129646-22

All versions operate with a 1.5 mm Allen key or driver

Divides PCBs in a steady, even motion to reduce risk of component damage

Available with or without thread locker

Works as a traditional standoff

Designated for PCI/104-Express™, VITA™ 42, 57.1, and 57.4 systems

For use with SamArray® and SEARAY™ connectors designed for VITA™ 42, 57.1, and 57.4 applications

ASP-103614-04, ASP-103612-04, ASP-189983-02, ASP-200178-01, ASP-200191-01, ASP-200179-01

ASP-134602-01, ASP-134488-01, ASP-134486-01, ASP-134606-01, ASP-134604-01, ASP-134603-01

ASP-188588-01, ASP-184330-01, ASP-184329-01, ASP-196174-01, ASP-186900-01, ASP-186899-01

8.5 mm, 10 mm, 12 mm, and 15.24 mm board stack heights available

Accommodates blind mating in perpendicular applications

Mates with GPPK Series guide post

Use with PCB thickness of .062" (1.60 mm) to .125" (3.18 mm)

Pairs with most high-speed connector strips and arrays

Accommodates blind mating in perpendicular applications

Mates with GPSK guide post socket

Pairs with most high-speed connector strips and arrays

Built-in grounding pin enables first mate last break (FMLB) capability

2 mm minimum ground pin wipe prior to connector mate

Supports blind mate applications

500 mating cycles

Pairs with SEARAY™ high-density arrays (SEAM-RA/SEAF, SEAF-RA/SEAM)

ASP versions for VITA™ 90 VNX+ applications

Mates with GPPKM guide post

2 mm minimum ground pin wipe prior to connector mate

Supports blind mate applications

500 mating cycles

Pairs with SEARAY™ high-density arrays (SEAM-RA/SEAF, SEAF-RA/SEAM)

Mates with GPSKM guide post socket with grounding pin

ASP versions for VITA™ 90 VNX+ applications

Right-angle orientation

Guide module for EBTF-RA and EBTM Series

Vertical or right-angle orientation

Guide module for EBTF-RA and EBTM Series

Provides ruggedization of high-speed edge cards

Enables elevated stack heights from 25 mm to 60 mm

Ideal for high-density multi connector applications

Assists with blind mate and board alignment

Minimizes tolerance stack and improves positional alignment by establishing the PCB distance

Compatible with Samtec’s HSEC6-DV edge card socket; additional compatibility in development