SI test platform for evaluating the RF capabilities of SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays
Overview
Samtec's SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays offer up to 50% board space savings compared to .050" (1.27 mm) pitch SEARAY™ interconnects. The SEARAY™ 0.80 mm Analog Over Array™ SI Evaluation Kit provides system designers, SI engineers, and RF engineers an easy-to-use solution for testing the RF capabilities of SEARAY™ 0.80 mm connectors.
The SEARAY™ 0.80 mm Analog Over Array™ SI Evaluation Kit (REF-236733-X.XX-XX) delivers a high-quality system of two PCBs with robust mechanical design. Please contact Samtec's technical experts at KitsAndBoards@samtec.com for additional information.
Documents
E-Brochure
Test Reports
White Papers
Features
- Two PCB system with compact form factor
- One PCB contains SEAF8 series connector (SEAF8-50-05.0-S-10-3)
- Second PCB contains SEAM8 series connector (SEAM8-50-S05.0-S-10-3)
- Supports 10 mm stack height
- Routes differential pairs (6 total) and single-ended signals (6 total) from SEARAY™ 0.80 mm connectors to high-precision RF connectors
- Supports multiple high-precision RF connector options (1.85 mm/2.40 mm/2.92 mm)
- Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
- Enable time domain measurements via direct connection to TDR/TDTs
- Enable frequency domain measurements via direct connection to VNAs
Applications
- FPGA/SoC/RFSoC Evaluation and Development Boards
- Embedded Computing Boards
- Phased Array Radars
- Remote Radio Heads
- Active Antenna Systems
- Wireless Base Stations
- Electronic Warfare
- SIGINT
Ordering Information
Contact KitsAndBoards@Samtec.com for additional ordering information.
