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SI test platform for evaluating 0.635 mm pitch, 112 Gbps PAM4 AcceleRate® HP high-performance arrays.
Overview
Samtec 0.635 mm pitch, 112 Gbps PAM4 AcceleRate® HP high-performance arrays support high-performance applications with maximum routing and grounding flexibility via an open-pin-field design. The AcceleRate® HP SI Evaluation Kit (REF-218313-X.XX-XXX) provides system designers and SI engineers an easy-to-use solution for testing AcceleRate® HP connectors.
The AcceleRate® HP SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec's technical experts at KitsAndBoards@samtec.com for additional information.
Features
- Two PCB system with compact form factor
- One PCB contains APM6 series connector (APM6-020-XX.X-L-04-2-A-XR)
- Second PCB contains APF6 series connector (APF6-020-XX.X-L-04-2-A-XR)
- Supports two APM6/APF6 stack heights (5 or 10 mm)
- Routes 8x high-speed differential pairs from APM6/APF6 connectors to high-precision RF connectors
- Supports multiple high-precision RF connector options (1.85 mm/2.40 mm/2.92 mm, SMA)
- Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
- Enable time domain measurements via direct connection to TDR/TDTs
- Enable frequency domain measurements via direct connection to VNAs
Applications
- Neural networks
- PICMG® COM-HPC® Modules and Carrier Cards
- FPGA/SoC Evaluation and Development Boards
- Embedded Computing Boards
- Networking
- Test and measurement
- Wired communication
- Wireless communications
Ordering Information
Please see drawing REF-218313-X.XX-XXX for more detail.
Contact KitsAndBoards@Samtec.com for additional ordering information.
