SI test platform for evaluating 0.635 mm pitch AcceleRate® mP high-density, high-speed signal/power arrays.
Overview
The Samtec AcceleRate® mP high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds on a 0.635 mm pitch. Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity, reduced crowding, and simplified breakout region (BOR).
The AcceleRate® mP SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing AcceleRate® mP connectors.
The AcceleRate® mP SI Evaluation Kit (REF-232521-X.XX-XX) delivers a high-quality system with robust mechanical design. It can be used standalone for AcceleRate® mP connectors. Please contact Samtec's technical experts at KitsAndBoards@samtec.com for additional information.
Features
- Two PCB system with compact form factor
- One PCB contains UDM6 series connector (UDM6-10-2-XX.X-L-A-TH-TR)
- Second PCB contains UDF6 series connector (UDF6-10-2-XX-X-L-A-TH-TR)
- Supports multiple UDM6/UDF6 stack heights (5 and 10 mm, up to 16 mm on roadmap)
- Routes 8x high-speed differential pairs from UDM6/UDF6 connector to high-precision RF connectors
- Supports multiple high-precision RF connector options (1.85 mm/2.40 mm/2.92 mm)
- Features optimized SI performance via Samtec Final Inch® BOR PCB trace routing
- Enable time domain measurements via direct connection to TDR/TDTs
- Enable frequency domain measurements via direct connection to VNAs
Applications
- FPGA/SoC Evaluation and Development Boards
- Embedded Computing Boards
- 5G/6G RRH/AAU
- Networking
- Test and measurement
- Wired communication
Ordering Information
Please see drawing REF-232521-X.XX-XX for more detail.
Contact KitsAndBoards@Samtec.com for additional ordering information.
