VITA™ 57.1-compliant FMC™ module increases board-to-board spacing over FPGA carrier cards.
Overview
Samtec LP Array™ Low Profile Open-Pin-Field Arrays support high-speed, high density applications with maximum routing and grounding flexibility. The LP Array™ SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing LP Array™ connectors.
The LP Array™ SI Evaluation Kit delivers a high-quality system with robust mechanical design. It can be used standalone for LP Array™ connectors. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.
Features
- Two PCB system with compact form factor
- One PCB contains LPAM connector (LPAM-40-XX-X-L-08-2-K-TR)
- Second PCB contains LPAF connector (LPAF-40-XX.X-L-08-2-K-TR)
- Supports multiple LPAM/LPAF stack heights (4 mm/4.5 mm/5 mm)
- Routes high-speed differential pairs (20 total) from LPAM/LPAF connectors to high-precision RF connectors
- Supports multiple high-precision RF connector options (2.40 mm/2.92 mm SMAs)
- Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
- Enable time domain measurements via direct connection to TDR/TDTs
- Enable frequency domain measurements via direct connection to VNAs
Applications
- FPGA/SoC Development Boards
- Servers
- Storage
- Networking
- Test and measurement
- Wired communication
- Wireless communications
Ordering Information
Please see drawing REF-200470-X.XX-X.XX-01 for more detail.
Contact KitsAndBoards@Samtec.com for additional ordering information.
