As data rates increase, trace length on PCBs decreases. Samtec's high-speed, Flyover® cable assemblies simplify PCB design and limit signal degradation in high data rate applications. The AcceleRate® HP Flyover® SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the AcceleRate® HP High-Density, High-Performance Cable System.

The AcceleRate® HP DP Flyover® SI Evaluation Kit (REF-230038-X.XX-XX) routes 8 differential pairs through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series.

The AcceleRate® HP SE Flyover® SI Evaluation Kit (REF-231683-X.XX-XX) routes 8 single-ended signals through Precision RF connectors, an AcceleRate® HP High-Density, High-Performance Cable Assembly and 0.635 mm AcceleRate® HP Sockets for ARP6 Series.

The AcceleRate® HP Flyover® SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at KitsAndBoards@samtec.com for additional information.

• Two PCB systems with compact form factor
• Each PCB contains one 0.635 mm AcceleRate® HP Socket for ARP6 Series (APF6-025-03.5-L-04-2-L-TR)
• PCBs connect via one 0.635 mm AcceleRate® HP High-Density, High-Performance Cable System
• Kits support multiple cable lengths (10” and 20”)
• Routes high-speed signals from ARP6-L connectors to Precision RF connectors
• Supports multiple Precision RF Compression Mount options (1.85 mm/2.40 mm/2.92 mm)
• Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
• Enable time domain measurements via direct connection to TDR/TDTs
• Enable frequency domain measurements via direct connection to VNAs