SI test platform for evaluating Si-Fly® 112 Gbps PAM4, Low-Profile High-Density Cable System
Overview
As data rates increase, trace lengths on PCBs decrease. Samtec's high-speed, Flyover® solutions simplify PCB design and limit signal degradation in high data rate applications. The Si-Fly® Flyover® SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing the Si-Fly® 112 Gbps PAM4, Low-Profile High-Density Cable System.
The Si-Fly® Flyover® SI Evaluation Kit (REF-224260-X.XX-XXX) routes eight high-speed differential pairs through Precision RF connectors, a Copper Si-Fly® Cable System and a Copper Si-Fly® High-Density Interconnect.
The Si-Fly® Flyover® SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.
Samtec Part No REF-224260-2.40-01 Pictured
Features
- Two PCB system with compact form factor
- Each PCB contains one CPI series (CPI-16-01-2-S-RA-2-L-XX) Si-Fly® Low-Profile, High-Density Interconnect
- PCBs connect via one of two Copper Si-Fly® Low-Profile, High-Density Cable Systems (CPC-16-X-XX.X-2-02-L-X)
- Kits comes with two CPC series standard cable lengths (6”, 12”)
- Routes high-speed differential pairs (8) from CPI series connectors to high-precision RF connectors
- Supports multiple high-precision RF connector options
- Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
- Enable time domain measurements via direct connection to TDR/TDTs
- Enable frequency domain measurements via direct connection to VNAs
Applications
- Servers
- Storage
- Networking
- Test and measurement
- Wired communication
- Wireless communications
Ordering Information
Please see drawing REF-224260-X.XX-XXX for more detail.
Contact KitsAndBoards@Samtec.com for additional ordering information.
