SI test platform for evaluating Si-Fly® HD 224 Gbps PAM4 Interconnect Systems
Overview
As data rates increase, trace lengths on PCBs decrease. Samtec's high-speed, Flyover® solutions simplify PCB design and limit signal degradation in high data rate applications. The Si-Fly® HD SI Evaluation Kits provide system designers and SI engineers an easy-to-use solution for testing the Si-Fly® HD 224 Gbps PAM4 Co-Packaged & Near Chip Systems.
The Si-Fly® HD NCC SI Evaluation Kit (REF-246550-X.XX-XX) routes sixteen high-speed differential pairs through Precision RF connectors, a Si-Fly® HD Near-Chip Cable Assembly and Si-Fly® HD Near-Chip Connectors.
The Si-Fly® HD SI Evaluation Kits deliver a high-quality system with robust mechanical design. Please contact Samtec's technical experts at KitsAndBoards@samtec.com for additional information.
Features
- Two PCB system with compact form factor
- Each PCB contains one SFNM series Si-Fly® HD Near-Chip Connector (SFNM-DP-04-04-01-VT-S-TR)
- PCBs connect via one SFNC series Si-Fly® HD Near-Chip Cable Assembly (SFNC-DP-1-04-04-VT-12.0-A-1)
- Kits comes with one SFNC series standard cable length (12")
- Routes high-speed differential pairs (16) from SNFM series connector to high-precision RF connectors
- Supports multiple high-precision RF connector options
- Optimized SI performance via Samtec Final Inch® BOR PCB trace routing
- Enable time domain measurements via direct connection to TDR/TDTs
- Enable frequency domain measurements via direct connection to VNAs
Applications
- Ai Acceleration Platforms
- 224 Gbps PAM4 Networking Applications
- Scale-up/Scale-out Data Center Networks
- Near-chip/Near-package copper
Ordering Information
Please see drawing REF-246550-X.XX-XX for more detail.
Contact KitsAndBoards@Samtec.com for additional ordering information.
