Silicon-to-Silicon

Application Solutions

Solutions & Support for Next Gen System Demands


5G/6G Networking, HPC/Artificial Intelligence and Smart/Connected Technologies are driving unprecedented industry growth. New AI and data center system architectures demand increased bandwidth, frequency, density, and scalability. Balancing these requirements with concerns such as power consumption, cost, and time-to-market increase the challenges of Next Gen data transmission exponentially.

Samtec helps address these issues with industry-leading signal integrity expertise, full system optimization strategies, and innovative products and technologies enabling the path to 448 Gbps performance and beyond.

448Gbps
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High-Performance Interconnect
Solutions

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Full System
Signal Integrity
Optimization

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Online Design
Tools & Technical
Resources

Integration leads to Innovation

High-Performance System Design & Support from Silicon-to-Silicon™


At Samtec, integration leads to innovation. Global collaboration guides advanced technology development with a goal of bringing the most effective and innovative solutions to life. As bandwidth, scale and power requirements continue to challenge conventional engineering methods, we want to help optimize the landscape of your entire system – and develop solutions, together. Please visit Samtec Technology Centers to learn more.

Evaluation & Development


Samtec Development Boards and SI Evaluation Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations; customized kits are also available for application specific evaluation.

Visit samtec.com/kits for additional details, or contact kitsandboards@samtec.com to discuss your application.

accelerate mini kit