SILICON-TO-SILICON
APPLICATION SOLUTIONS
5G Networking, HPC/Artificial Intelligence and Smart/Connected Technologies are driving unprecedented industry growth. New system architectures demand increased bandwidth, frequency, density and scalability. Balancing these requirements with concerns such as power consumption, cost and time-to-market increase the challenges of Next Gen data transmission exponentially.
Samtec helps address these issues with industry-leading signal integrity expertise, full system optimization strategies, and innovative products and technologies enabling the path to 224 Gbps performance and beyond.
High-Performance
Interconnect
Solutions
Full System
Signal Integrity
Optimization
Online Design
Tools & Technical
Resources
At Samtec, integration leads to innovation. Global collaboration guides advanced technology development with a goal of bringing the most effective and innovative solutions to life. As bandwidth, scale and power requirements continue to challenge conventional engineering methods, we want to help optimize the landscape of your entire system – and develop solutions, together. Please visit Samtec Technology Centers to learn more.
Evaluation & Development
Samtec Development Boards and SI Evaluation Kits help simplify the design process and reduce time to market. Kits are available for many of our high-performance connector sets and standard high-speed cable assembly configurations; customized kits are also available for application specific evaluation.
Visit samtec.com/kits for additional details, or contact kitsandboards@samtec.com to discuss your application.
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PRODUCTS
- ExaMAX® High-Speed Backplane System
- NovaRay® Extreme Density Arrays & Cables
- NovaRay® I/O Panel Mount Cable System
- AcceleRate® Extreme Density & Performance Systems
- Si-Fly® LP Low-Profile, High-Density Cable System
- FireFly™ Optical Micro Flyover System™
- Flyover® QSFP Cable Systems
- Bulls Eye® High-Performance Test to 90 GHz
