“IEEE (Institute of Electrical and Electronics Engineers) and its members inspire a global community to innovate for a better tomorrow through its more than 423,000 members in over 160 countries, and its highly cited publications, conferences, technology standards, and professional and educational activities. IEEE is the trusted “voice” for engineering, computing, and technology information around the globe.”

- IEEE Official Website

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FireFly™ Optical Micro Flyover System™ (ECUO)

FireFly™ optical provides the flexibility to achieve higher data rates to 28 Gbps at greater distances with a miniature footprint for increased density. By utilizing Flyover® technology, the data connection is taken “off board,” thus simplifying PCB design and enhancing performance.

IEEE FireFly ECUO
Extended Temperature FireFly™ Optical Micro Flyover System™ (ETUO)

Extended Temp FireFly™ ranges from -40 ºC to +85 ºC for military, aerospace and industrial applications with data rates up to 25 Gbps. Error free transmission was demonstrated during applied external vibrations and shock testing to methods specified in MIL-STD-810.

IEEE FireFly ETUO

IEEE EPS TC-EDMS Packaging Benchmark Reference Designs

The IEEE Electronic Packaging Society (EPS) Technical Committee on Electrical Design, Modeling and Simulation (TC-EDMS) Packaging Benchmark Suite aims to provide information about electromagnetic, electrical and circuit modeling and simulation problems encountered, and the computational methods used when designing, analyzing, and developing electronic packages.

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