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COM-HPC® Standard Products and Support
COM-HPC® Standard Products and Support
Overview
The development of COM-HPC® exceeds the demand for high-speed performance in embedded CoMs/SoMs. COM-HPC® coexists with the COM Express® specification but provides the scalability and enhanced performance for next-gen embedded system design.
The base COM-HPC® specification defines two module types. COM-HPC® server modules are targeted for edge server applications. COM-HPC® client modules support robust embedded computing. The COM-HPC® 1.2 specification introduced a more compact client form factor, COM-HPC® Mini, targeting traditional embedded computing applications.
COM-HPC® also provides access to more system memory (up to 1 TB RAM) and system flexibility for various compute engines beyond x86 architectures like RISC-V CPUs, GPGPUs, FPGAs and DSPs.
| COM-HPC Server | COM-HPC Client | COM-HPC Mini | |||
|---|---|---|---|---|---|
| 65x PCIe | 49x PCIe | 16x PCIe with Target Support* | 4 lanes shared with 2x SATA and 2x ETH Serdes | ||
| 4x USB 4.0 | 4x USB4* | Alternative use as USB 3.2 or up to 2x DDI | |||
| 2x USB 4.0 | 4x USB 3.2 x 1*/ 2x USB 3.2 x 2* | Shared with USB4 | |||
| 2x USB 3.1 | 4x USB 2.0 | 8x USB 2.0* | Party used for USB4 and USB3.2 | ||
| 4x USB 2.0 | 2x SATA | 2x SATA* | Shared with PCle lanes | ||
| 2x SATA | 12x GPIO, 2x UART | 12x GPIO, 2x UART, 1x CAN | |||
| 12x GPIO | eSPI, 2x SPI | eSPI, 2x SPI, SMB, 2x I2C | |||
| 2x UART | SMB, 2x I2C, IPMB | 2x MIPI-CSI on flatfoil connector | |||
| eSPI, 2x SPI | 2x SoundWire, 12S | HDA/12S, 2x SoundWire | |||
| SMB, 2x I2C, IPMB | 2x NBaseT (max. 10 Gb) | FuSa | |||
| 1x NBaseT (max. 10 Gb) | 3x DDI | 2x NBaseT, 2x NBaseT Serdes* | Serdes shared with PCle lanes | ||
| 8x 25GBE KR | eDP | 2x 25GBE KR | 2x DDI*, 1x eDP | DDI shared with USB4 | |
| Power 12V DC | Power 8-20V DC | Power 8-20V DC | |||
| * Some interfaces are shared. | |||||
| Check congatec.com/COM-HPCmini for details | |||||
COM-HPC® CONNECTORS
COM-HPC® Server and Client modules use a pair of 400 pin connectors (800 pins total) based on Samtec's AcceleRate® HP High-Performance Arrays. The new COM-HPC® Mini module removes one of the 400-pin connectors.
Samtec COM-HPC® connectors support existing and future interfaces such as PCIe® 5.0 (32 Gbps), PCIe® 6.0 (64 Gbps PAM4), 25 GbE channels, 40 Gbps USB4/Thunderbolt, 80 Gbps DisplayPort signals, and other high-bandwidth interfaces. The connector pinouts are optimized for Mini, Client or Server modules as defined in the COM-HPC® specification.
In all applications, the female Module Receptacles are employed at a standard height. The male Carrier Plugs vary to allow for either a 5 mm or 10 mm stack height.
PRINTS & PADs
|
Samtec Part Number |
ConnectorsModule Receptacle Carrier Plug Stack Height |
OptionsTermination Weld Tabs Plating |
Design SupportPrints PADS |
|---|---|---|---|
| ASP-230332-03 |
X
|
Column X -L |
|
| ASP-230333-03 |
X 5 mm |
Column X -L |
——— |
| ASP-230336-03 |
X 10 mm |
Column X -L |
——— |
| ASP-230332-04 |
X
|
Column X -S |
|
| ASP-230333-04 |
X 5 mm |
Column X -S |
——— |
| ASP-230336-04 |
X 10 mm |
Column X -S |
——— |
| ASP-230332-01 |
X
|
Ball X -L |
|
| ASP-230333-01 |
X 5 mm |
Ball X -L |
|
| ASP-230336-01 |
X 10 mm |
Ball X -L |
|
| ASP-230332-02 |
X
|
Ball X -S |
——— |
| ASP-230333-02 |
X 5 mm |
Ball X -S |
——— |
| ASP-230336-02 |
X 10 mm |
Ball X -S |
——— |
| ASP-209946-01 |
X
|
Ball
-L |
|
| ASP-214802-01 |
X 5 mm |
Ball
-L |
|
| ASP-209948-01 |
X 10 mm |
Ball
-L |
|
| ASP-209946-02 |
X
|
Ball
-S |
|
| ASP-214802-02 |
X 5 mm |
Ball
-S |
|
| ASP-209948-02 |
X 10 mm |
Ball
-S |
COM-HPC® Standard
For questions regarding the COM-HPC® Standard and additional information, please contact us at:
