MicroSAM^® Standard Products and Support

Overview

MicroSAM® proposes a new PICMG effort to create a microcontroller-agnostic postage-stamp form factor for the enablement of smart sensors.

The new form-factor will be targeted at helping traditional sensor vendors quickly create smart sensors without having to worry about the control domain of the sensor. When combined with the PICMG sensor domain network architecture and data model, sensors will seamlessly integrate into the network with plug-and-play interoperability.

The specification will benefit the industry through:

Enabling sensor vendors to create smart sensors without having to manufacture the control circuitry or software.
Enabling controller suppliers who wish to create smart sensors or smart-sensor components to do so in a way that is interoperable with other suppliers.
Accelerating the uptake of smart-sensor technology through open-specifications and interoperability.

MicroSAM^®

As specified in the PICMG MicroSAM® Standard, the smart sensor connector based on our T1M family features a micro-pitch of 1.00 mm (.0394”) suitable for extremely small form factors.

MicroSAM® defines three discrete wire terminals on the PCB at 4, 6, and 18-pin configurations.

**MicroSAM® - Specified Connectors (T1M)**
	Terminal (Carrier Side)			Options		Design Support
Samtec PN	4-pin Configuration	6-pin Configuration	18-pin Configuration	Row Specification	Plating: F=3 µ" Gold	Prints	3D	PADS
ASP-217716-01	x			Single Row, Horizontal	F	PDF Print	IGES PARASOLID STEP	PADS File
ASP-217716-02		x		Single Row, Horizontal	F	PDF Print	IGES PARASOLID STEP	PADS File
ASP-217716-03			x	Single Row, Horizontal	F	PDF Print	IGES PARASOLID STEP	PADS File

Test Reports