VITA™ 57.1 FMC™ Connector Standard Products And Support

VITA™ 57.4 FMC+™ - SEARAY™ (HSPC/HSPCe)

VITA™ Standards specify configurations for the SEARAY™ High-Speed Array VITA™ 57.1 FPGA Mezzanine Card (FMC) connector in 8.5 mm and 10 mm stack heights. The (LPC) connectors provide 68 user-defined, single-ended signals (or 34 user-defined, differential pairs); (HPC) connectors provide 160 user-defined, single-ended signals (or 80 user-defined, differential pairs), 10 serial transceiver pairs and additional clock.

  Configure Your Product Using the Options Below

VITA™ 57.1 (FMC) Specified Connectors (SEARAY™)

HDR Cable Assembly Options for FMC™

These high-speed, high-density array cable assemblies feature micro coax cable and rugged Edge Rate® contacts.

VITA™ 57.1 JSOM

Some FPGA mezzanine cards may present a challenge to unmate from their host. To aid in separation, Samtec has developed the JSOM (Micro Jack Screw Standoff). They act as a traditional standoff when collapsed. An Allen-key unscrews and expands the jack screw, dividing the PCBs in a steady, even motion until the mezzanine is safely separated from its host. The JSOM standoff family includes M2.5, M3, and #4-40 hardware available in 8.5 mm and 10 mm stack heights.

VITA™ 57.1 (FMC) Micro Jack Screw Stand Offs (JSOM)

Expanded Height for FMC™ Applications

The VITA™ 57.4 FMC™ Extender Card (REF-228680-01) has been designed for placement between FPGA Carrier Cards and FMC™ Modules. This increased space can be used for additional I/O expansion during development. The FMC™ Extender Card also provides a cost-effective option for extending the life of the FPGA Carrier Card HPC connectors used as test platforms.

Features

• High Pin Count (HPC) VITA™ 57.1 FMC™ male connector (Samtec P/N: ASP-134488-01)
• High Pin Count (HPC) VITA™ 57.1 FMC™ female connector (Samtec P/N: ASP-134486-01)

Xilinx® and its Alliance Program Members offer the industry's most comprehensive offering of FPGA Development Boards and Design Services to help speed developer’s time-to-revenue over a wide variety of application needs. Xilinx® has selected Samtec High Speed Connector and Cable interconnect Solutions for their latest generation Evaluation Boards featuring the Kintex UltraScale, Virtex UltraScale FPGA’s, and Zynq UltraScale+ RFSoCs.

Virtex UltraScale+

• Virtex UltraScale+ FPGA VCU118

Zynq UltraScale+

• Zynq UltraScale+ RFSoC ZCU1275

Virtex UltraScale

• Virtex UltraScale FPGA VCU110
• Virtex UltraScale FPGA VCU108
• Virtex UltraScale FPGA VCU1287

Kintex UltraScale

• Kintex UltraScale FPGA KCU105
• Kintex UltraScale FPGA KCU1250

Intel® development kits provide a complete, high-quality design environment for engineers. They simplify the design process and reduce time to market. Intel® has selected Samtec High Speed interconnect solutions for many of their Boards and Kits.

Intel® Arria® 10 FPGA Development Board

Samtec Products on FPGA Baseboard:

• VITA™ 57.1 FMC™ (HPC) 400 I/O Female Connectors (SEARAY™ ASP-134486-01) Add to Cart

Mating Connectors for Mezzanine Card:

• For 10 mm stack: ASP-134488-01 | Sample | Quote Add to Cart
• For 8.5 mm stack: ASP-134602-01 | Sample | Quote Add to Cart

Development Kit

Intel® Arria® 10 FPGA Signal Integrity Kit

Samtec Products on FPGA Baseboard:

• Landing Pads for Bulls Eye® High Density RF Test Point System (Bulls Eye® HDR-187150-01-BEYE)

Development Kit

Intel® HSMC

The Intel® HSMC defines electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way in which mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features found in today’s FPGA devices, manufacturers can build a single mezzanine card that will then interface to multiple host boards.

Similarly, they can build a host board that can leverage many different, pre-built, mezzanine cards. The HSMC connectors defined by the specification are based on the 0.50 mm pitch Q Strip® QSH/QTH products high speed board-to-board connectors from Samtec. The Samtec interconnect for the mezzanine card is ASP-122952-01. See the complete HSMC Specification from Intel® for further information and recommendations for running both high-frequency and low speed interface signals within the various “banks."

High-Speed Cable Assemblies to Interface with HSMC Connectors:

• HDR-131992-XX-HQDP: Quote | Print | Technical Support
• HDR-138276-XX-HQCD: Quote | Print | Technical Support

Custom HDR cable assemblies for HSMC are available in various lengths with a variety of terminal/socket end options and orientations.

Samtec Products on FPGA Baseboard:

• VITA™ 57.1 FMC™ (HPC) 400 I/O Female Connector (SEARAY™ ASP-134486-01) Add to Cart

Mating Connectors for Mezzanine Card:

• For 10 mm stack: ASP-134488-01 | Sample | Quote Add to Cart
• For 8.5 mm stack: ASP-134602-01 | Sample | Quote Add to Cart

• High Speed Mezzanine Card (HSMC) Connectors (Q Strip® ASP-122953-01) Add to Cart

Mating Connectors for Mezzanine Card:

• Q Strip® ASP-122952-01 Add to Cart
• High Density RF Test Point Receptacle and Cable Bulls Eye® BAR-J-22 & BE25S-01SP1-01.0-02-0152

Development Kit

Microsemi provides a selection of development kits & boards for FPGA and SoC FPGA designs that include Libero SoC design software, power, and Programming & Debug Tools to begin your next design.

Intel® Arria® 10 FPGA Development Board

This kit is ideally suited for high-speed transceiver evaluation, 10Gb Ethernet, IEEE1588, JESD204B, SyncE, SATA and more. The kit connections include a high pin count (HPC) FPGA mezzanine card (FMC), numerous SMAs, PCIe, Dual Gigabit Ethernet RJ45, SFP+ and USB.

Samtec product on kit:

Mating Connectors for Mezzanine Card:

• VITA™ 57.1 FMC™ (HPC) 400 I/O Female Connectors (SEARAY™ ASP-134486-01) Add to Cart
• For 10 mm stack: ASP-134488-01 | Sample | Quote Add to Cart
• For 8.5 mm stack: ASP-134602-01 | Sample | Quote Add to Cart

The Expanding FMC™ Ecosystem

As FMC™ leverages open platforms and standards, developers are working to further the adaptation of programmable device technologies in the marketplace. Many of these developers are working closely with Samtec to support a variety of applications, including:

• FMC™ daughter cards / modules
• FPGA-based development boards with provisions for FMC™ expansion
• FPGA-based networking cards with provisions for FMC™ expansion, along with optical interfaces
• FPGA-based characterization platforms with provisions for FMC™ expansion
• Embedded systems such as networking development bridge cards

Available from Samtec, some of the key interconnect solutions being used to support these technologies include:

• VITA™ 57.1 FMC™ interconnects
• FireFly™ Micro Flyover System™
• Bulls Eye® Test Point system
• 75 Ω High-Density BNC for 12G-SDI