VITA™ 74 VNX™ Form Factor Standard Products And Support

Overview

VITA™ 74 VNX™ introduces a new approach to rugged Small Form Factor (SFF) design. Its unique module-based format offers system architects greater freedom in developing COTS SFF systems. VNX's machined chassis, robust backplane, and conduction-cooled modules unite to form an extremely rugged assembly.

Defining mechanical and electrical requirements, VNX™ form factor embodies a small-scale VPX architecture, simplified to satisfy a new range of applications. The Standard encourages vendors to supply system components, including modules, backplanes, enclosures, and completed solutions.

SOSA eBrochure

SOSA™ Aligned Interconnect Solutions

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VITA™ 74

VITA™ 74 - SEARAY™ Right-Angle (HPC/LPC)

Building on the successful performance of VITA™ 57.1, VITA™ 74 VNX™ specifies high-density SEARAY™ Right-Angle connectors in 12.5 mm and 19 mm stack heights. These were chosen for their high-speed capabilities and rugged design.

VITA™ 74 (VNX) Specified Connectors (SEARAY™ Right-Angle)

Samtec PN Connectors Solder
Ball
Type
Options Design Support
12.5 mm Mated
(LPC 200 pin)
19 mm Mated
(HPC 400 pin)
Alignment Pins
(-A)
Tape & Reel
(-TR)
Plating:
S=30µ" Gold
Prints 3D PADS
ASP-161073-03 Male Lead-Free X X S PDF Print IGES
PARASOLID
STEP
PADS File
ASP-161074-03 Female Lead-Free X X S PDF Print IGES
PARASOLID
STEP
PADS File
ASP-161073-04 Male Lead-Free X X S PDF Print IGES
PARASOLID
STEP
PADS File
ASP-161074-04 Female Lead-Free X X S PDF Print IGES
PARASOLID
STEP
PADS File

The Exapnding VNX™ Ecosystem

Expanding VNX™ Ecosystem

The embedded marketplace continues to drive SWaP (Size, Weight, and Power) requirements to the extreme. Many of these demands call for high performance but at a much-reduced size and power. VITA™ 74 standard based products serve markets needing ruggedized products requiring Data Plane interconnect technologies that closely follow the industry state of the art. Various vendors are already incorporating these VNX™ technologies offering features such as:

  • Small Form Factor (SFF) switched serial interconnects
  • Open-frame backplane design
  • Legacy I/O compatibility at the Plug-In Module level
  • Available in variable chassis heights of 12.5 mm and 19 mm

VITA™ 74 VNX™ Standard

For questions regarding the VITA™ 74 VNX™ Standard and additional information, please contact us at:

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