VITA™ 42 XMC™ is a widely deployed mezzanine Standard used in high-reliability computers implementing switched-fabric architectures. This Standard combines PCI Mezzanine Card (PMC) with serial fabric technology on proven mezzanine form-factors.
In 2017, VITA™ updated its base specification to recommend solderball connectors. Original parts employed Paste-On-Pad attachment, while recommended parts utilize modern solderball technology. Listed below are the recommended Sam Array® connectors, plus optional JSOM ejector standoffs to assist in XMC™ card un-mating.
VITA™ 42 XMC™ specifies solderball-equipped Sam Array® connectors in 10mm and 12mm stack heights. Solder options include Lead-free and Tin-lead alloys.
|
Samtec PN |
Socket (Carrier Side)10mm Mated 12mm Mated LIF Contacts |
Terminal
|
Solder
|
OptionsKapton Pad (-K) Alignment Pins (-A)
Tape & Reel Plating: H=30µ" Gold or E=50µ" Gold |
Design SupportPrints PADS |
|---|---|---|---|---|---|
| ASP-103612-01 |
X
|
|
Tin-Lead |
X
X H |
|
| ASP-103612-02 |
X
|
|
Lead-Free |
X
X H |
|
| ASP-103612-03 |
X
|
|
Tin-Lead |
H |
|
| ASP-103612-04 |
X
X |
|
Lead-Free |
X
X H |
|
| ASP-103612-05 |
X
X |
|
Tin-Lead |
X
X H |
|
| ASP-103614-01 |
|
X |
Tin-Lead |
X
X H |
|
| ASP-103614-04 |
|
X |
Lead-Free |
X
X H |
|
| ASP-189983-01 |
X X |
|
Tin-Lead |
X
X H |
|
| ASP-189983-02 |
X X |
|
Lead-Free |
X
X H |
These high-speed, high-density array cable assemblies feature micro coax/twinax cable and high-reliability Tiger Eye™ contacts.
| SAMTEC P/N | END-TO-END CABLE LENGTH |
DESCRIPTION | END 1 XMC™ CONNECTOR ON CABLE | END 2 XMC™ CONNECTOR ON CABLE | CONNECTOR MOUNTING ON CABLE |
|---|---|---|---|---|---|
| HDR-209511-01 HDR-209511-02 | 300 mm 550 mm |
High Data Rate Cable, (XMC) female to (XMC) male | ASP-103612-01 | ASP-103614-01 | Same Side |
Some express mezzanine cards may present a challenge to unmate from their host. To aid in separation, Samtec has developed the JSOM (Micro Jack Screw Standoff.) They act as a traditional standoff when collapsed. An Allen-key unscrews and expands the jack screw, dividing the PCBs in a steady, even motion until the mezzanine is safely separated from its host. The JSOM standoff family includes M2.5, M3, and #4-40 hardware available in 10mm and 12mm stack heights.
|
Samtec PN |
Thread Locker |
M2.5 Thread*10mm 12mm |
M3 Thread10mm 12mm |
#4-40 Thread10mm 12mm |
Design SupportPrints 3D |
|---|---|---|---|---|---|
| ASP-198471-02 |
YES |
X
|
|
|
|
| ASP-198471-03 |
YES |
X |
|
|
|
| ASP-199169-02 |
YES |
|
X
|
|
|
| ASP-199169-03 |
YES |
|
X |
|
|
| ASP-199167-02 |
YES |
|
|
X
|
|
| ASP-199167-03 |
YES |
|
|
X |
|
| ASP-198471-05 |
NO |
X
|
|
|
|
| ASP-198471-06 |
NO |
X |
|
|
|
| ASP-199169-05 |
NO |
|
X
|
|
|
| ASP-199169-06 |
NO |
|
X |
|
|
| ASP-199167-05 |
NO |
|
|
X
|
|
| ASP-199167-06 |
NO |
|
|
X |
This Standard allows for greater configuration of embedded systems on both ends of the market. With a focus dedicated to flexibility, express mezzanine cards allow the designer to add modules for greater performance, additional functionality, or to upgrade an existing system. Due to this modular design, it is well-suited for a wide variety of technologies advancing at different rates, thus extending the resourcefulness of its mezzanine/carrier cards. Key features include:
Cutriss-Wright's open architecture COTS based rugged embedded computing XMC™ solutions acquire, process and display data in real time to support mission-critical functions. Curtiss-Wright plays a key industry role in the establishment of resources and services to ensure that customers have access to the long lifecycle support required by aerospace and defense programs. Curtiss-Wright offers comprehensive approaches for mitigating obsolescence, blocking the use of counterfeit parts, and developing product roadmaps to ease the integration of future generations of technologies.
Products include:
Featured Samtec Products:
The Technobox XMC™ to PCI Express® adaptor with Rear I/O support provides up to 8X lanes of connection from the XMC™ P15 connector to the PCI Express® edge finger. Additional configurations can support PCI Express® Gen 1 (2.5 Gb/s), Gen 2 (5 Gb/s), and Gen 3 (8 Gb/s).
Key features include:
Featured Samtec Products:
The XPedite7501 XMC™ module utilizes Intel’s 5th generation i7 Broadwell-H processor to provide high performance with low power consumption. Offering up to three PCI Express® Gen 3-capable ports and two Gigabit Ethernet ports, the XPedite7501 proves to be an ideal solution for high-bandwidth data processing applications.
Additional features include:
Featured Samtec Products:
Purpose-built for extreme, high-bandwidth interface and FPGA co-processing applications, the New Wave DV V1153 will withstand harsh environments while staying within your SWaP and budget requirements. New Wave's V1153 card provides the highest port density, bandwidth, and processing power for radar, signal intelligence, remote sensing, medical imaging, and embedded telecommunications systems in a single XMC™ form factor.
Additional features include:
Featured Samtec Products:
For questions regarding this Standard and additional information, please contact us at:
