Overview
VITA™ 42 XMC™ is a widely deployed mezzanine Standard used in high-reliability computers implementing switched-fabric architectures. This Standard combines PCI Mezzanine Card (PMC) with serial fabric technology on proven mezzanine form-factors.
In 2017, VITA™ updated its base specification to recommend solderball connectors. Original parts employed Paste-On-Pad attachment, while recommended parts utilize modern solderball technology. Listed below are the recommended Sam Array® connectors, plus optional JSOM ejector standoffs to assist in XMC™ card un-mating.
VITA™ 57.1 FMC™ Connectors
VITA™ 42 - Sam Array®
VITA™ 42 XMC™ specifies solderball-equipped Sam Array® connectors in 10mm and 12mm stack heights. Solder options include Lead-free and Tin-lead alloys.
Configure Your Product Using the Options Below
| Samtec PN | Socket (Carrier Side) | Terminal (Mezzanine Side) |
Solder Ball Type |
Options | Design Support | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10 mm Mated | 12 mm Mated | LIF Contacts | Standard Height | Kapton Pad (-K) |
Alignment Pins (-A) |
Tape & Reel (-TR) |
Plating: H=30µ" Gold or E=50µ" Gold |
Prints | PADS | |||
| ASP-103612-01 | X | Tin-Lead | X | X | H | PDF Print | PADS File | |||||
| ASP-103612-02 | X | Lead-Free | X | X | H | PDF Print | PADS File | |||||
| ASP-103612-03 | X | Tin-Lead | H | PDF Print | PADS File | |||||||
| ASP-103612-04 | X | X | Lead-Free | X | X | H | PDF Print | PADS File | ||||
| ASP-103612-05 | X | X | Tin-Lead | X | X | H | PDF Print | PADS File | ||||
| ASP-103614-01 | X | Tin-Lead | X | X | H | PDF Print | PADS File | |||||
| ASP-103614-04 | X | Lead-Free | X | X | H | PDF Print | PADS File | |||||
| ASP-189983-01 | X | X | Tin-Lead | X | X | H | PDF Print | PADS File | ||||
| ASP-189983-02 | X | X | Lead-Free | X | X | H | PDF Print | PADS File | ||||
HDR Cable Assembly Options for XMC™
These high-speed, high-density array cable assemblies feature micro coax/twinax cable and high-reliability Tiger Eye™ contacts.
| Samtec PN | End-to-End Cable Length | Description | End 1 XMC™ Connector On Cable | End 2 XMC™ Connector On Cable | Connector Mounting On Cable |
|---|---|---|---|---|---|
|
HDR-209511-01 HDR-209511-02 |
300 mm 550 mm |
High Data Rate Cable, (XMC) female to (XMC) male |
ASP-103612-01 | ASP-103614-01 |
Same Side |
VITA™ 42/V61 - JSOM
Some express mezzanine cards may present a challenge to unmate from their host. To aid in separation, Samtec has developed the JSOM (Micro Jack Screw Standoff.) They act as a traditional standoff when collapsed. An Allen-key unscrews and expands the jack screw, dividing the PCBs in a steady, even motion until the mezzanine is safely separated from its host. The JSOM standoff family includes M2.5, M3, and #4-40 hardware available in 10mm and 12mm stack heights.
VITA™ 42 (XMC) Micro Jack Screw Stand Offs (JSOM)
| Samtec PN | Thread Locker | M2.5 Thread* | M3 Thread | #4-40 Thread | Design Support | ||||
|---|---|---|---|---|---|---|---|---|---|
| 8.5 mm | 10 mm | 8.5 mm | 10 mm | 8.5 mm | 10 mm | Prints | 3D | ||
| ASP-198471-02 | Yes | X | PDF Print | STEP | |||||
| ASP-198471-03 | Yes | X | PDF Print | STEP | |||||
| ASP-199169-02 | Yes | X | PDF Print | STEP | |||||
| ASP-199169-03 | Yes | X | PDF Print | STEP | |||||
| ASP-199167-02 | Yes | X | PDF Print | STEP | |||||
| ASP-199167-03 | Yes | X | PDF Print | STEP | |||||
| ASP-198471-05 | No | X | PDF Print | STEP | |||||
| ASP-198471-06 | No | X | PDF Print | STEP | |||||
| ASP-199169-05 | No | X | PDF Print | STEP | |||||
| ASP-199169-06 | No | X | PDF Print | STEP | |||||
| ASP-199167-05 | No | X | PDF Print | STEP | |||||
| ASP-199167-06 | No | X | PDF Print | STEP | |||||
* - Meets VITA™ mezzanine standoff specifications
The Expanding XMC™ Ecosystem
The Expanding XMC™ Ecosystem
This Standard allows for greater configuration of embedded systems on both ends of the market. With a focus dedicated to flexibility, express mezzanine cards allow the designer to add modules for greater performance, additional functionality, or to upgrade an existing system. Due to this modular design, it is well-suited for a wide variety of technologies advancing at different rates, thus extending the resourcefulness of its mezzanine/carrier cards. Key features include:
- High-speed switched interconnects
- Connectors able to provide power, ground, and auxiliary signals to mezzanine
- Compatibility with existing PMC specifications
- Features Standard VME, CompactPCI, Advanced TCA, and PCI Express® carriers
- Available in variable stacking heights of 10 mm and 12 mm
Curtiss-Wright SBC, Graphics and I/O XMC™ Modules
Cutriss-Wright's open architecture COTS based rugged embedded computing XMC™ solutions acquire, process and display data in real time to support mission-critical functions. Curtiss-Wright plays a key industry role in the establishment of resources and services to ensure that customers have access to the long lifecycle support required by aerospace and defense programs. Curtiss-Wright offers comprehensive approaches for mitigating obsolescence, blocking the use of counterfeit parts, and developing product roadmaps to ease the integration of future generations of technologies.
Products include:
- XMC-121 Intel 7th Generation (Kaby Lake) Xeon XMC™ Processor
- XMC-120 Intel Atom Bay Trail XMC™ Processor
- XMC-109 NXP Power Architecture P2020 XMC™ Processor
- XMC-715 AMD E4690 Graphics Controller XMC™
- XMC-603 MIL-STD-1553 XMC™
- XMC-FPGA05D
- XF07-523 FPGA Digital I/O XMC™
Featured Samtec Products:
- VITA™ 42 XMC™ (10 mm/12 mm Lead-Free) 114 I/O Male Connector (Sam Array® ASP-103614-04)
Technobox Reverse Compact XMC-to-PCIe® Adaptor 8X
The Technobox XMC™ to PCI Express® adaptor with Rear I/O support provides up to 8X lanes of connection from the XMC™ P15 connector to the PCI Express® edge finger. Additional configurations can support PCI Express® Gen 1 (2.5 Gb/s), Gen 2 (5 Gb/s), and Gen 3 (8 Gb/s).
Key features include:
- Convection cooling airflow for lower power XMCs
- Optional fan assembly (P/N 8254) for higher power XMCs
- Can accommodate air or conduction-cooled configurations
- DIP Switch configuration for geographical address, available power, and XMC™ status signals
Featured Samtec Products:
- VITA™ 42 XMC™ (10 mm Lead-Free) 114 I/O Female Connector (Sam Array® ASP-103612-04)
X-ES XPedite7501 5th Generation Intel® Core™ i7 Broadwell-H Processor-Based XMC™ Module
The XPedite7501 XMC™ module utilizes Intel’s 5th generation i7 Broadwell-H processor to provide high performance with low power consumption. Offering up to three PCI Express® Gen 3-capable ports and two Gigabit Ethernet ports, the XPedite7501 proves to be an ideal solution for high-bandwidth data processing applications.
Additional features include:
- Intel® Iris™ Pro graphics which doubles as general-purpose GPU
- Up to 8 GB of DDR3L-1600 ECC SDRAM in two channels
- One x4 PCI Express® Gen 3-capable link
- Meets XMC™ Form Factor
- And much more…
Featured Samtec Products:
- VITA™ 42 XMC™ (10 mm Lead-Free) 114 I/O Male Connector (Sam Array® ASP-103614-01)
New Wave DV V1153 12-Port Rugged XMC™ FPGA Card with Optical
Purpose-built for extreme, high-bandwidth interface and FPGA co-processing applications, the New Wave DV V1153 will withstand harsh environments while staying within your SWaP and budget requirements. New Wave's V1153 card provides the highest port density, bandwidth, and processing power for radar, signal intelligence, remote sensing, medical imaging, and embedded telecommunications systems in a single XMC™ form factor.
Additional features include:
- Twelve 1G to 25G optical lanes to MPO front panel I/O or VITA™ 66 optical I/O
- Xilinx® Virtex/Kintex UltraScale+ FPGA
- Supports PCIe® Gen 3 x16 and Gen 4 x8
- PPS time synchronization with µSec resolution
- Thermal sensors for monitoring card temperature
- Robust FPGA development framework
- Streaming front-end FPGA core for quick sensor integration
- Available in air- and conduction-cooled XMC™ form factors
- And much more...
Featured Samtec Products:
- VITA™ 42 XMC™ (10 mm Lead-Free) 114 I/O Male Connector (Sam Array® ASP-103614-01)
- FireFly™ Extended Temperature Active Optical Micro Flyover Cable Assembly (ETUO Product)
- FireFly™ Positive Latching Receptacle (UCC8 Product)
- Up To 20 Gbps FireFly™ Edge Card Socket Assembly (UEC5-1 Product)
