| SEAF/SEAM - 7mm Mated Height High Speed Characterization Report |
| SEAF/SEAM - 10mm Mated Height High Speed Characterization Report |
| SEAF/SEAMP - 7mm Mated Height High Speed Characterization Report |
Overview
Based on XMC™, VITA™ 88.0 XMC+™ defines an alternative connector from the same family used in FMC™/FMC+™. While not intermateable with VITA™ 42.0 connectors, the VITA™ 88.0 connector is designed to be backwards compatible with VITA™ 42.0 electrical footprints. This allows designers to improve existing VITA™ 42.0 and/or VITA™ 61.0 designs by swapping connectors.
Next generation XMC+™ designs utilize an updated solder footprint and blade/beam style contact system. The result is superior SI supporting PCIe® 5.0 (32 GT/s) and 100 GbE operation, and improved mechanical performance and durability. All of this is achievable at stacks up to 18 mm.
VITA™ 88
VITA™ 88 - SEARAY™
Borrowing from the FMC/FMC+™ design community, the XMC+™ connector is a modified solder ball-equipped SEARAY™ that provides lower mating/unmating force and improved performance offered by blade & beam contacts.
- VITA™ 88.0 XMC+™ connectors solder to existing VITA™ 42.0/VITA™ 61.0 electrical footprints, providing backward compatibility in most applications that adhere to traditional layout guidelines.
- Elevated terminal and standard socket connectors improve channel performance and follow traditional XMC™ geometry.
- Robust housing features protect contacts from stubbing or bent pins.
- Rated at 1,000 cycles, the VITA™ 88.0 contact system increases mating durability over VITA™ 42.0/VITA™ 61.0, both rated at 500 cycles.
- IPC Class 3 compliant solder charges available in both tin-lead and lead-free RoHS versions.
- Available in 10 mm, 12 mm, 16 mm, and 18 mm stack heights.
| Samtec PN | Socket (Mezzanine Side) |
Terminal (Carrier Side) |
Solder Ball Type |
Options | Plating | Design Support | |||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 10 mm Mated | 12 mm Mated | 16 mm Mated | 18 mm Mated | Kapton Pad (-K) |
Alignment Pins (-A) |
Tape & Reel (-TR) |
S=30µ" Gold | Prints | 3D | PADS | |||
| ASP-212942-01 | X | Tin-Lead | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212942-02 | X | Lead-Free | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212942-03 | X | Tin-Lead | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212942-04 | X | Lead-Free | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212953-01 | X | Tin-Lead | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212953-02 | X | Lead-Free | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212953-03 | X | Tin-Lead | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212953-04 | X | Lead-Free | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212954-01 | X | Tin-Lead | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212954-02 | X | Lead-Free | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212954-03 | X | Tin-Lead | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212954-04 | X | Lead-Free | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212955-01 | X | Tin-Lead | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212955-02 | X | Lead-Free | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212955-03 | X | Tin-Lead | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212955-04 | X | Tin-Lead | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
| ASP-212956-01* | X | Tin-Lead | X | X | X | S | |||||||
| ASP-212956-02 | X | Lead-Free | X | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | ||||
| ASP-212956-03* | X | Tin-Lead | X | X | S | ||||||||
| ASP-212956-04 | X | Lead-Free | X | X | S | PDF Print |
IGES PARASOLID STEP |
PADS File | |||||
* Coming soon. Samtec will be supporting these part numbers for an 18 mm mated height. Contact standards@samtec.com.
VITA™ 88 - Standoffs
To achieve backwards electrical compatibility, VITA™ 88.0 utilizes a narrowed standoff to accommodate the alternate connector assemblies.
- VITA™ 88.0 defines the use of specialized rectangular standoffs to accommodate the XMC+™ connectors.
- Mechanically supports stack heights of 10 mm, 12 mm, 16 mm, and 18 mm.
HDR Cable Assembly Options for XMC+
These high-speed, high-density cable assemblies are ideal for benchtop testing, system debugging, probing, FPGA development, or for regularly accessing a system where cards would need to be separated from the host board.
| Samtec PN | End-to-End Cable Length | Description | End 1 XMC+™ Connector On Cable | End 2 XMC+™ Connector On Cable | Connector Mounting On Cable |
|---|---|---|---|---|---|
|
HDR-239802-01 |
14" (356 mm) |
High Data Rate, Socket to Terminal Transition Cable |
ASP-212942-02 | ASP-212953-02 |
Opposite Side |
|
HDR-239802-02 |
26" (660 mm) |
High Data Rate, Socket to Terminal Transition Cable |
ASP-212942-02 | ASP-212953-02 |
Opposite Side |
