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Technical Library

Samtec’s Technical Library contains white papers, application/technical notes, published papers, webinars, and presentations that aim to keep you informed on high-performance system design. These resources underscore how Samtec’s solution blocks support interconnectivity needs across multiple industries, applications, performance requirements, and operating environments. Visit our Videos page to see demonstrations, webinars, products and more in action.

White Papers/Case Studies
Document Type Date Link Created By
10/24Software Defined Manufacturing: Enabling Industrial Automation Samtec
05/24PCI Express®-Over-Optics in Embedded Applications: A Guide to Easy Implementation Jean-Frédéric Gauvin, Dolphin Interconnect Solutions & Matthew Burns, Samtec
01/24Achieving 224 Gbps PAM4: Interconnect Challenges, Advantages, and Solutions Samtec
09/23Building the Oxide Rack: Samtec Case Study Samtec
09/23Channel Performance Metric: A new Definition of Interconnect Signal Integrity Performance Samtec
06/23Millimeter Wave Design: Optimizing Performance in RF Compression Mount Connectors Michael Griesi, Zak Speraw, Edwin Loy & Sage Wronowski, Samtec
06/23Why Use Flyover® Cable Systems? Anthony Fellbaum, Samtec
06/23Array Connectors for Mixed-Signal Multi-Channel RFSOCs up to 8 GHz White Paper Chris Kocuba, Kiana Montes & Juan Aguirre, Samtec
05/23Pin and Blade Assignment Considerations in Samtec UDX Connectors Istvan Novak and Gary Biddle, Samtec
05/23Improved Solder Joint Integrity for High-Density Interconnect Applications Robbie Huffman & David Decker, Samtec
01/23Signal Integrity Handbook: Reference for the Selection of High-Performance Interconnects for Signal Integrity Optimized System Design Samtec
11/22Impacts of Solder Reflow on High Bandwidth RF Connectors Michael Griesi and Chris Shelly, Samtec
05/22Wideband RF Launches: Much More Than Footprints on PCBs Samtec
06/21System and Component Qualifications of VPX Solutions Steven Searle-Spratt and Douglas Caldes, EIZO; Shane Dabrowski and John Riley, Samtec
01/21Shaken Not Stirred! Vibration Testing Explained David P. Scopelliti, Samtec
03/18Calculating Mating and Unmating Forces for Samtec Connectors Kevin Meredith
11/16Effects of Lubrication on Connector Processing Kevin Meredith
01/14Simplified Pulse Current (Duty Cycle) Guidelines David P. Scopelliti, Samtec
04/13The Pain of Fretting Corrosion David P. Scopelliti, Samtec
04/13Galvanic (Electrolytic) Corrosion David P. Scopelliti, Samtec
10/07Power and Voltage Rating David P. Scopelliti, Samtec
Application/Technical Notes
Document Type Date Link Created By
10/19VITA™ 57.4 FMC+™ Extender Application Note Samtec
10/19VITA™ 57.4 FMC+™ Loopback Cards Application Note Samtec
10/19Mechanical Design of Micro Jack Screw Precision Board Stacking Standoff Application Note Samtec
10/19Mechanical Design of High Data Rate Cable Assembly for VITA™ 57.4 Application Note Samtec
03/18Thermal Design of QSFP-DD Cages and Heatsinks Application Note Samtec
10/16PCIE - Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s, Right Angle Samtec
05/16FireFly™ Optical Half Cables Application Note Samtec
09/15FQSFP Flyover® QSFP Technical Note Samtec Samtec
05/15PCIE - Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s, Edge Mount Samtec
01/15PCI Express® PCIEC/PCIE - High Speed Designs in PCI Express® Applications Generation 3 - 8.0 GT/s, 85 Ohm Samtec
12/14Edge Rate® ERM8/ERF8 - 16mm Stack Height High Speed Designs in PCI Express® Applications, Generation 3 - 8.0 GT/s Samtec
12/14Edge Rate® HSEC8-DV - PCI Express® High Speed 8mm Vertical Edge Rate Card Socket Final Inch® Designs in PCI Express Applications Generation 3 - 8.0 GT/s Samtec
04/13Q Strip® QSH/QTH 16mm Stack Height High Speed Designs in PCI Express® Applications, Generation 3 - 8.0 GT/s Samtec
02/12SEAM-RA/SEAF-RA Products Final Inch® Designs in PCI Express® Applications Generation 3 - 8.0 GT/s Samtec Teraspeed Consulting
Published Papers
Document Type Date Link Created By
04/24A Signal Integrity Case Study for PICMG COM-HPC Mini Modules - Embedded World 2024 Matthew Burns, Brandon Gore, Samtec
03/24Improve Alignment of Compression-Mount Connectors in Wireless Designs – Microwaves & RF Zak Speraw, Samtec
02/24Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization - DesignCon 2024 Julia Van Burger, Istvan Novak, Gustavo Blando, Samtec; Amazon, Oracle, Cadence
01/24Survey on Correlation & Simulation Methodologies for PCB Structures Through 67 GHz - DesignCon 2024 Robert Branson, Greylan Smoak, Scott McMorrow, Steve Krooswyk, Samtec
01/24Realistic Use Cases for Edge, Angled and Vertical Launch Connectors Up to 100 GHz - DesignCon 2024 Sandeep Sankararaman, Shawn Tucker, Istvan Novak, Gustavo Blando, Samtec
01/24Comparing the Different Metrics of Intra-pair Skew in Tracking Channel Performance - DesignCon 2024 Richard Mellitz, Adam Gregory, and Steve Krooswyk, Samtec; Achronix Semiconductor Corp., Intel Corp.
01/24Are 1.0 mm Precision RF Connectors Really Required for 224 Gbps PAM4 Verification? - DesignCon 2024 Brandon Gore, Richard Mellitz, Andrew Josephson, Samtec; University of L’Aquila; Keysight Technologies
01/24Introducing an Upcoming IEEE Packaging Benchmark (Signal Integrity Journal) Istvan Novak & Gustavo Blando, Samtec; Cadence; Oracle; Amazon; ST Microelectronics
11/23High Density Optical Transceiver Packaging Using Glass Substrates and Through Vias - ICSJ2023 Kevin Burt, John Coronati, Nathan Robertson, Joe Ahadian, Marc Epitaux, Sandra Skendzic, Chris Bohn, and Adam Owens, Samtec
07/23Wideband RF Launches: More than Footprints on a PCB - Microwave Product Digest Sandeep Sankararaman and Shawn Tucker, Samtec
07/23Evolving Small Form Factor Architecture for The SOSA™ Technical Standard Samtec, Collins Aerospace, Antara Teknik, Ideas-TEK & Trident Infosol
07/233D Connection Artifacts in PDN Measurements (Signal Integrity Journal) Gustavo Blando, Samtec et. al.
06/23Next-Generation PCB Loss Analysis (Signal Integrity Journal) Brandon Gore, Samtec
05/23VITA™ 90: Small Form Factors for UAVs and Other Space Constrained Platforms (Aerospace & Defense Technology) Bill Ripley, Samtec
03/23How to Reliably Align Compression Connectors for mmWave Applications (Microwave Journal) Jean-Jacques DeLisle, IXS
03/23Shock, Vibration, and Corrosion: Avoiding Damaging Effects in High-Performance Connectors, Harsh Environment / Remote Locations (connectorsupplier.com) eBook (pp. 19-22) Jan Hrouda, Alex Wroten, Matt Brown, Samtec
03/23Selecting a Backplane: PCB vs. Cable for High-Speed Designs (Signal Integrity Journal) Andrew Josephson, Brandon Gore, and Jonathan Sprigler, Samtec
01/233D Connection Artifacts in PDN Measurements - DesignCon 2023 Amazon, Cadence, Oracle, Ampere Computing, STMicroelectronics, Samtec
01/23A Novel Approach to 224 Gb/s Reference Receiver Design Using Raised Cosine Response for Noise Mitigation - DesignCon 2023 Keysight, University of L'Aquila, Samtec
01/23Cascaded vs. End-to-End Multi-Pin Interconnect Simulation Models - DesignCon 2023 Robert Branson, Samtec
11/22Reflecting on Reflections: An Evaluation of New and Standardized Metrics - DesignCon 2022 Samtec, Achronix, Intel
08/21Hidden/Secrets of IBIS Sampling Specifications - DesignCon 2021 Achronix Semiconductor, Samtec, Keysight, IBIS Enthusiast
08/21Impact of Power Plane Termination on System Noise - DesignCon 2021 Amazon, Cadence, Oracle, Samtec
08/21Specification-based IBIS-AMI Model PCIe 5.0 32GT/s - DesignCon 2021 Keysight, Samtec, Achronix Semiconductor, IBIS Enthusiast
08/21A Case Study in the Development of 112 Gbps PAM4 Silicon and Connector Test Platform - DesignCon 2021 Samtec, Alphawave
08/21Design Case Study and Experimental Validation for a 100 Gb/s per Lane C2M Link Using Channel Operating Margin - DesignCon 2021 Keysight, University of L'Aquila, Samtec
01/20Current Distribution, Resistance, and Inductance in Power Connectors - DesignCon 2020 Samtec
01/20Finding Reflective Insertion Loss Noise and Reflectionless Insertion Loss - DesignCon 2020 Achronix Semiconductor Corporation, Samtec, Intel Corporation
01/20Validation of Achieving 100 Gb/s Signaling per Electrical Lane over 2 Meters of Passive Twinaxial Copper Cable - DesignCon 2020 MC Communications, Keysight, Cisco, UNH-IOL, Samtec
05/19Attenuation of High Frequency Signals in Structured Metallization on Glass: Comparing Different Metallization Techniques with 24 GHz, 77 GHz and 100 GHz Structures Brandon Gore, Samtec; SCHOTT AG; Varioprint AG; Schweizer Electronic AG; Grand Joint Technology Ltd.; KOTO Electric Co.; Packaging Research Center, Georgia Tech; Institute for Microwave Engineering and Photonics, TU Darmstadt
04/19Creepage and Clearance David P. Scopelliti, Samtec
01/18Designing DC Blocking Capacitor Transitions to Enable 56 Gbps NRZ & 112 Gbps PAM4 - DesignCon 2018 Scotty Neally and Scott McMorrow, Samtec Teraspeed Consulting
01/17Design of Flyover® QSFP (FQSFP) for 56+ Gbps Applications - DesignCon 2017 Missouri University of Science and Technology, Samtec, Xilinx
01/16Microwave Interconnect Testing For 12G-SDI Applications - DesignCon 2016 Imagine, Keysight, Samtec
10/15Strike Up The Bandwidth! Scott McMorrow, Samtec Teraspeed Consulting
02/15Optimizing Symmetry in Open Pin Field Designs - DesignCon 2015 Julian Ferry, Samtec
02/15Causality Demystified - DesignCon 2015 (DesignCon15 Best Paper Award Finalist) Stefaan Sercu, Samtec
02/15Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions - DesignCon 2015 Scott McMorrow, Samtec Teraspeed Consulting
04/14High I/O BGA Connector Solder Joint Integrity Investigation Dave Hillman, Rockwell Collins
02/13Advances in Onboard Optical Interconnects: A New Generation of Miniature Optical Engines - DesignCon 2013 Marc Verdiell, Samtec Optical Group
02/12Connector Models - Are they any good? - DesignCon 2012 Samtec
02/12Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains - DesignCon 2012 Samtec & Dupont
gEEk spEEk Webinars
Document Type Date Link
10/24 Ask Me Anything (AMA) with SI Experts
09/24 Python Automation of Measurement and Multi-Dimensional of DC and AC Bias Sensitivity of MLCCs
08/24 Evaluate Cable Assembly EMC Performance across 40 GHz
07/24 Are 1.0 mm Precision RF Connectors Really Required for 224 Gbps-PAM4 Verification?             
05/24 Realistic Use Cases for Coaxial PCB Connectors up to 100GHz    
04/24 3 Design Tips for Power Distribution Networks
03/24 Advantages and Limitations of Generalized Open Pin Field Modeling for Array Connectors
02/24 Deep Dive into PCB Characteristics for Correlation/Simulation at 224G and Below
01/24 DesignCon 2024 Preview - Samtec SI Experts
11/23 Array Connectors for Multi-Channel Antennas-to-Bits System Architectures
10/23 Staying Grounded in the Real World (Return Path Imperfections)
09/23 How to Bring S-Parameters Into Your Simulation Tool
08/23 Mechanical Considerations for Compression Mount RF Connectors
07/23 Breakout Design: Near Package Cable Connectors
06/23 Breakout Design: Package and Traces
05/23 SerDes CM Noise: How Much is Too Much?
04/23 SI 101: Fundamentals of S-Parameters
03/23 How to Measure Low PDN Impedance
02/23 SI/PI AM(A)A - A Conversation with Scott McMorrow
01/23 DesignCon 2023 Preview
12/22 Impacts of Solder Reflow on High Bandwidth RF Connectors
10/22 Precision RF Connector PCB Launches for 224 Gbps Devices
08/22 Cascaded or End-to-End Interconnect Models
06/22 Reverberation Cavities for I/O Connector EMI Performance
04/22 Mitigating the Effect of Connector Mating & Normal Forces in Signal Integrity
02/22 Single Ended Analysis in a Differential World
12/21 Pros & Cons of Thin Laminates in Power Distribution
11/21 In PDN, Loss May Be Your Friend But Inductance Is Your Enemy
10/21 Advanced High Density Breakout Design and Crosstalk Mitigation Strategies
09/21 Key Development Steps of 112 Gbps PAM4 Test Platforms
08/21 How to Read the ESR Curve of Capacitors
07/21 Common Mode Conundrums
06/21 Advanced Test Fixture Design
05/21 Causality Correction or No Causality Correction, That is the Question
04/21 Successful PCIe® Interconnect Guidelines at 8, 16 and 32 GT/s
03/21 Mechanics of Running COM
02/21 Bending EM Tools to Your Will
01/21 S and Z Parameters for PDN Measurements and Simulations
12/20 Using Ferrites and Inductors in Power Distribution Networks
11/20 Effective Return Loss - What is ERL and How is it Computed?
10/20 XTLK Mitigation Strategies in 12G-SDI Systems
10/20 Waveguides, Modes and Cutoff Frequencies
09/20 Periodical Discontinuities
09/20 Noise and Simulation Correlation
08/20 High-Speed Connector SI Round-Up
08/20 Trace Corner Bends
07/20 Signal Power & Noise and SI
07/20 Do You Know How Much Capacitance You Really Get? – Multi-Layer Capacitor (MLCC) Loss
07/20 IEEE Channel Operating Margin (COM) for Channel Analysis
06/20 Trace Design for Crosstalk Reduction
06/20 Break Out Design by Inspection
06/20 Impedance Corrected De-Embedding
06/20 DC Block Capacitor Location - Does it Really Matter?
05/20 Component Crosstalk Characterization by ICN
05/20 Quantifying Glass Induced Skew on Printed Circuit Boards
05/20 The Perils of Right-Angle Turns at DC
05/20 Twinax Basics
04/20 PCI Express: Is 85 Ohms Really Needed?
Presensations
Document Type Date Link Created By
01/24DesignCon 2024 - Impact of Finite Interconnect Impedance Including Spatial and Domain Comparison of PDN Characterization Julia Van Burger, Istvan Novak, Gustavo Blando, Samtec; Amazon, Oracle, Cadence
01/24DesignCon 2024 - Survey on Correlation & Simulation Methodologies for PCB Structures Through 67 GHz Robert Branson, Greylan Smoak, Scott McMorrow, Steve Krooswyk, Samtec
01/24DesignCon 2024 - Realistic Use Cases for Edge, Angled and Vertical Launch Connectors Up to 100 GHz Sandeep Sankararaman, Shawn Tucker, Istvan Novak, Gustavo Blando, Samtec
01/24DesignCon 2024 – PCI Express & PAM4: The Pathway to 128 GT/s and Challenges of Building Interoperable 64 GT/s Capable Systems Panel Discussion Steve Krooswyk, Samtec; and Keysight Technologies, Amphenol, Tektronix, Synopsys
01/24DesignCon 2024 - Comparing the Different Metrics of Intra-pair Skew in Tracking Channel Performance Richard Mellitz, Adam Gregory, and Steve Krooswyk, Samtec; Achronix Semiconductor Corp., Intel Corp.
01/24DesignCon 2024 - Are 1.0 mm Precision RF Connectors Really Required for 224 Gbps PAM4 Verification? Brandon Gore, Richard Mellitz, Andrew Josephson, Samtec; University of L’Aquila; Keysight
01/20DesignCon 2020 - Current Distribution, Resistance, and Inductance in Power Connectors Samtec
01/20DesignCon 2020 - Finding Reflective Insertion Loss Noise and Reflectionless Insertion Loss Achronix Semiconductor Corporation, Samtec, Intel Corporation
01/20DesignCon 2020 - Panel - PCIe 32G & 64G: System Design & Test Challenges
01/18DesignCon 2018 - Designing DC Blocking Capacitor Transitions to Enable 56 Gbps NRZ & 112 Gbps PAM4 Scotty Neally and Scott McMorrow, Samtec Teraspeed Consulting
01/18DesignCon 2018 - Understanding Skin Effect and Dielectric Loss Material Effects on Digital Interconnects Dr. Edward Sayre, Samtec
01/17DesignCon 2017 - Design of Flyover® QSFP (FQSFP) for 56+ Gbps Applications Missouri University of Science and Technology, Samtec, Xilinx
08/16Autonomous Vehicles: Successfully Integrating New Chips, Packages & Modules Steve Groothuis, Samtec Microelectronics
05/16SerDes and Its Role In Future Designs Rod Strange, Samtec Teraspeed Consulting
04/16DDR4 Design and Verification In Hyperlynx LINESIM/Boardsim Rod Strange, Samtec Teraspeed Consulting
02/16DesignCon 2016 - A Material World, Modeling Dielectrics And Conductors For Interconnects Operating at 10-50 Gbps Scott McMorrow, Samtec Teraspeed Consulting
02/16DesignCon 2016 - Design Considerations For A Cost Optimized 28 G/56 G PAM4 Backplane Scott McMorrow and Edward Sayre, Samtec Teraspeed Consulting
02/16DesignCon 2016 - Optics Vs. Copper For In-Chassis Connections @ 56-112 Gbps: Is Copper Still A Viable Solution? Avago, Cisco, Samtec, Tektronix
02/16DesignCon 2016 - Microwave Interconnect Testing for 12G SDI Applications Jim Nadolny, Samtec
02/13DesignCon 2013 - Advances in Onboard Optical Interconnects: A New Generation of Miniature Optical Engines Marc Verdiell, Samtec Optical Group
04/12Using ADS to post Process Simulated and Measured Models Leon Wu
02/12DesignCon 2012 - Connector Models - Are they any good? Samtec
02/12Comprehensive Analysis of Flexible Circuit Materials Performance in Frequency and Time Domains Samtec & Dupont
Data Sheets

Coax Cable

Document Type Link AWG Nominal Impedance (Ω) Min. Operating Temp (°C) Max. Operating Temp (°C)
50 Ohm, 38 AWG Micro Coax Cable (TCF-3850-XX-XX) 38 50 -25 105
50 Ohm, 38 AWG Micro Coax Cable HT (TCF-3850-XX-T01-TB) 38 50 -40 140
50 Ohm, 36 AWG Micro Coax Cable HT (TCF-3650F-XX-TXX) 36 50 -40 125
50 Ohm, 34 AWG Micro Coax Cable (TCF-3450F-XX-XX) 34 50 -25 105
50 Ohm, 34 AWG Micro ThinSE™ Coax Cable (TCF-3450F-01-PET-01) 34 50 -40 125
50 Ohm, 30 AWG Micro Coax Cable (TCS-3050F-XX-XX) 30 50 -25 105
50 Ohm, 28 AWG Micro Coax Cable (TCS-2850F-XX-XX) 28 50 -25 105
50 Ohm, 26 AWG Micro Coax Cable (TCF-2650F-XX-XX) 26 50 -25 105
50 Ohm, 26 AWG Braid Micro Coax Cable HT (CTB-2650F-01) 26 50 -40 200
75 Ohm, 38 AWG Micro Coax Cable (TCF-3875F-XX-XX) 38 75 -25 105

Twinax Cable

Document Type Link AWG Nominal Impedance (Ω) Min. Operating Temp (°C) Max. Operating Temp (°C)
85 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT (TTF-3485CU-01-T01-S) 34 85 -40 140
85 Ohm, 32 AWG CU Micro Twinax Cable (TTF-3285-XX-XX) 32 85 -25 105
85 Ohm, 30 AWG CU Micro Twinax Cable (TTF-3085CU-XX-XX) 30 85 -25 105
92 Ohm, 34 AWG Solid, CU Micro Thinax™ Cable HT (TTF-3492CU-01-PET-S) 34 92 -40 140
92 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT (TTF-3492CU-01-T01-S) 34 92 -40 140
95 Ohm, 30 AWG Micro Twinax Cable HT (TTF-30100-FEP-01-01) 30 95 -55 200
100 Ohm, 36 AWG Solid, CU Micro Twinax Cable (TTF-36100-XX-XX) 36 100 -25 105
100 Ohm, 34 AWG CU Micro Twinax Cable (TTF-34100-XX-XX) 34 100 -25 105
100 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT PVDF (TTF-34100CU-01-PVDF-S) 34 100 -40 140
100 Ohm, 34 AWG Solid, CU Micro Twinax Cable HT (TTF-34100CU-01-T01-S) 34 100 -40 140
100 Ohm, 32 AWG CU Micro Twinax Cable (TTF-32100-XX-XX) 32 100 -25 105
100 Ohm, 30 AWG CU Micro Twinax Cable (TTF-30100CU-XX-XX) 30 100 -25 105
100 Ohm, 30 AWG CU Micro Twinax Cable HT (TTF-30100CU-01-T01) 30 100 -40 140
100 Ohm, 30 AWG Solid, CU Micro Twinax Cable HT (TTF-30100CU-01-T01-S) 30 100 -40 140
100 Ohm, 28 AWG Solid, CU Micro Twinax Cable HT (TTF-28100CU-01-T01-S) 28 100 -40 140
100 Ohm, 26 AWG CU Micro Twinax Cable (TTF-26100-XX-XX) 26 100 -25 105

Power Cable

Document Type Link AWG Min. Operating Temp (°C) Max. Operating Temp (°C)
32 AWG Power Cable HT (TC) (DWCT-32-01-TC) 32 -40 200
30 AWG Power Cable HT-THV (SPL-30-XX-XX) 30 -40 125
30 AWG Power Cable HT (TC) (DWCT-30-01-TC) 30 -40 200
28 AWG Power Cable HT-THV (SPL-28-XX-XX) 28 -40 125
28 AWG Power Cable HT (TC) (DWCT-28-01-TC) 28 -40 200
26 AWG Power Cable HT-THV (SPL-26-XX-XX) 26 -40 125
24 AWG Power Cable HT (TC) (DWCT-24-01-TC) 24 -40 200
20 Ohm, 26 AWG Quiet Power Cable (TCF-2620-XX-XX) 20 -25 105
20 AWG Power Cable HT (TC) (DWCT-20-01-TC) 20 -40 200
16 AWG Power Cable HT (300 V) (DWCT-16-01) 16 -40 200
16 AWG Power Cable HT (600 V) (DWCT-16-01-600) 16 -40 200

IDC Cable

Document Type Link
30 AWG, 7/38 Stranded IDC Cable for a 1.27 mm Pitch Connector (CB-XX-30-7/38-025-GR)
28 AWG, 7/36 Stranded IDC Cable for a 2.00 mm Pitch Connector (TCB-XX)
28 AWG, 7/36 Stranded IDC Cable for a 2.54 mm Pitch Connector (CB-XX-28-7/36-XXX-X)

RF Cable

Document Type Link AWG Nominal Impedance (Ω) Min. Operating Temp (°C) Max. Operating Temp (°C)
50 Ohm, 26 AWG Braid Micro Coax Cable HT (CTB-2650F-01) 26 50 -40 200
50 Ohm, 25 AWG Micro Coax Cable (MWC-2550-01) 25 50 -40 200
50 Ohm, 23 AWG Micro Coax Cable (MWC-2350-01) 23 50 -40 200
50 Ohm, 23 AWG Solid, CU Micro Coax Cable (MWC-2350CU-01) 23 50 -65 125
100 Ohm, 28 AWG, Shielded Twisted Pair Cable (TPS-28100-RF) 28 100 -20 105
V-Band Flexible Waveguide Cable (WGCF-50-75-S-01) N/A N/A -65 125
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