112 Gbps Interconnect Increases Reach Between the ASIC and the Front Panel

Name: 112 Gbps Interconnect Increases Reach Between the ASIC and the Front Panel
Uploaded: 2019-02-26T15:13:29+00:00
Duration: 210S
Description: In this live demonstration at DesignCon 2019, J.R. Bonnefoy, a Systems Engineer at Samtec, explains how Samtec Flyover® offers a high-density escape from the system ASIC to the front panel.

In this live demonstration at DesignCon 2019, J.R. Bonnefoy, a Systems Engineer at Samtec, explains how Samtec Flyover® offers a high-density escape from the system ASIC to the front panel.