112 Gbps PAM4 Interconnect Models Simplify Channel-Wide Modeling and Simulation - Samtec - IMS 2024

Name: 112 Gbps PAM4 Interconnect Models Simplify Channel-Wide Modeling and Simulation - Samtec - IMS 2024
Uploaded: 2024-08-05T17:50:11+00:00
Duration: 663S
Description: To achieve accurate results, 112 Gbps PAM4 applications must view the PCB-Connector interface as a single segment. This presentation discusses how Samtec and Cadence collaborate to provide high-performance interconnect models that can be merged directly with Cadence PCB designs and support the next wave of high-speed simulation challenges.

To achieve accurate results, 112 Gbps PAM4 applications must view the PCB-Connector interface as a single segment. This presentation discusses how Samtec and Cadence collaborate to provide high-performance interconnect models that can be merged directly with Cadence PCB designs and support the next wave of high-speed simulation challenges.