200 Gbps Co-Packaged Copper Channel - Samtec Si-Fly-HD, Broadcom SerDes

Samtec presented several live product demonstrations showing 224 Gbps PAM4 interconnect solutions at DesignCon 2025. One which garnered much attention was in conjunction with our friends at Broadcom. This evaluation platform incorporates Broadcom's industry-leading 200 G SERDES technology and Samtec’s Si-Fly® high-density co-packaged copper cable systems. Co-packaged Copper Connectivity eliminates the insertion losses in the BGA breakout and the PCB. It enables a complete passive DAC 224 G channel that is both extreme performance and low cost. Samtec's Si-Fly HD CPC is the industry’s highest footprint density, robust interconnect, which enables 102.4T, that’s 512 lanes at 224G, in a 95 x 95 mm chip substrate. Contact us if you have questions: HDR@Samtec.com