448 Gbps Co-Packaged Copper Channel - Samtec - DesignCon 2026

Name: 448 Gbps Co-Packaged Copper Channel - Samtec - DesignCon 2026
Uploaded: 2026-03-09T19:01:31+00:00
Duration: 128S
Description: Samtec developed a prototype cable system representing a chip-to-chip, intra-tray GPU-to-GPU interconnect at 448 Gbps. A live demonstration of this system was showcased in the Samtec booth at DesignCon 2026. In the video above, Samtec’s Sandeep Sankararaman describes the demonstration and results.

Samtec developed a prototype cable system representing a chip-to-chip, intra-tray GPU-to-GPU interconnect at 448 Gbps. A live demonstration of this system was showcased in the Samtec booth at DesignCon 2026. In the video above, Samtec’s Sandeep Sankararaman describes the demonstration and results.