Samtec Si-Fly® HD Co-Packaged and Near Chip Connector Systems

Name: Samtec Si-Fly® HD Co-Packaged and Near Chip Connector Systems
Uploaded: 2026-03-18T12:57:21+00:00
Duration: 196S
Description: Samtec demonstrates Si-Fly® HD co-packaged and near-chip systems that provide a high-density 224 Gbps PAM4 solution. Electrically pluggable co-packaged copper and optics solutions are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector.

Samtec demonstrates Si-Fly® HD co-packaged and near-chip systems that provide a high-density 224 Gbps PAM4 solution. Electrically pluggable co-packaged copper and optics solutions are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector.