Webinar: Breakout Design: Package and Traces

Presenter: Scott McMorrow Scott McMorrow explains the technical challenges of breakout region (BOR) design for packages and traces, noting how they can dramatically affect the performance of a channel. He will walk through a specific example, providing guidance on the design of the package side of a near package cable (NPC) BOR that includes 1mm pitch balls on a 30-layer board for 112Gbps PAM4. Come join this technical discussion on “final inch” design and bring your questions.