Severe Environment Testing (SET)

SET (Severe Environment Testing) is a Samtec initiative to test certain products beyond typical industry standards and specifications, many of which are common requirements for harsh environment applications/industries.

Driven by demands for high functioning commercial standard interconnects, SET has proven beneficial in providing performance confidence, not only for rugged Mil/Aero industries and applications, but also for Automotive, Industrial and Medical applications.

Industries and Applications

Testing Specifications

Samtec interconnects are subject to a wide variety of standard test procedures that push the industry limits to help ensure quality and durability in any application. Severe Environment Testing includes Samtec’s standard DQT (Design Qualification Testing) and E.L.P.™ (Extended Life Product™) testing, along with additional testing for interconnect systems that will be used in more extreme/harsh applications or environments.

Samtec’s SET products are approved for NASA Class D missions that require high-reliability, quick-turn and cost-effective solutions for LEO satellites, SmallSats, CubeSats and other space exploration applications.

Samtec utilizes NASA outgassing data to determine if certain products meet NASA’s ASTM E595-77/84/90 test requirements. See Samtec’s Outgassing FAQ for more information.

Additional Tests Included with SET:

  • VITA™ 47.1 Module Insertions
  • VITA™ 47.3 Humidity
  • VITA™ 47.1 Operating Shock Class OS2
  • VITA™ 47.1 Vibration Class VS3
  • Exceeds VITA™ 47.1 Temperature Cycling Class C4
  • Exceeds VITA™ 47.1 Non-Operating Temperature Class C4
  • VITA™ 47.1 Electrostatic Discharge Resistance
  • Exceeds VITA™ 47.1 Altitude for DWV
Product Testing Guide

Product Testing Guide

Download PDF

SET Qualified Products

Samtec offers an extensive portfolio of cost-effective interconnect solutions engineered for rugged environments. All testing is completed in-house and can be customized upon request for specific application requirements. Contact set@samtec.com for additional details and available test results.

Tiger Eye™ 1.27 mm Pitch
Micro Rugged System

SFM TFM

SEARAY™ 1.27 mm Pitch
High-Density Arrays

SEAF SEAM

Razor Beam™ 0.50 mm Pitch
Hermaphroditic Strips

LSHM

.100" (2.54 mm) Pitch
Square Post Header & Socket

SSM TSM

.050" (1.27 mm) Pitch
Header & Socket System

CLP FTSH

Edge Rate® 0.80 mm Pitch
Rugged High-Speed Strips

ERF8 ERM8

Tiger Eye™ 2.00 mm Pitch
Rugged System

S2M T2M

mPOWER® 2.00 mm Pitch
Ultra Micro Power Connectors

UMPS UMPT

SEARAY™ 0.80 mm Pitch
Ultra-High Density Open-Pin-Field Arrays

SEAF8 SEAM8

URSA™ I/O 1.00 mm Pitch
Ultra Rugged I/O System

URSA I/O 1 mm Pitch Ultra Rugged I/O System

Tiger Eye™ .050" Pitch
Discrete Wire Cable Assembly

Tiger Eye DW

Micro Mate™ 1.00 mm Pitch
Discrete Wire Cable Assemblies

1MMDW

Coming Soon!

High-Speed Micro Coax &
Twinax Cable Assemblies

High-Speed Micro Coax

Coming Soon!

FireFly™ Copper
Micro Flyover System™

ECUO

Coming Soon!

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