Halo™ Next Gen Mid-Board Optical Transceivers

IN DEVELOPMENT - Designed for next gen embedded applications demanding 56/112 Gbps PAM4 performance in low profile and ruggedized form factors.

Features

Halo™ optical and copper systems are interchangeable using the same high-performance surface mount connector
Up to 16 channels and 112 Gbps PAM4 performance per lane
Protocol agnostic
Low profile designs for space savings
Designed to withstand high shock and vibration with a rugged 2-piece contact system
Supports data center, HPC and FPGA Protocols, including 10/40/100 (400/800 optics only) Gb Ethernet, InfiniBand™, Fibre Channel, PCIe®, CXL® and Aurora
Halo™ ring connector features up to 76 pins in a single row around the perimeter for vertical mating with optical and copper systems

IN DEVELOPMENT - Halo™ Next Gen Mid-Board Optical Transceivers

Designed for next gen embedded applications
56 Gbps PAM4 performance per lane; 112 Gbps PAM4 per lane in development
16 channels (x8 bidirectional)
Low 6.35 mm profile for space savings
Features a low center of gravity for a stable connection to the board
Optically pluggable for easy field replacement
Variety of heat sink options for conduction, convection, cold plates or liquid cooling thermal relief
Interchangeable with Halo™ next gen copper cable assembly using the same high-performance connector
Rugged surface mount connector with integrated locking latch mechanism simplifies mating/unmating of the cable assembly
Contact Optics@samtec.com for more information

IN DEVEOPMENT - Halo™ Copper Mid-Board Cable System

112 Gbps PAM4 performance per lane
16 channels (x8 bidirectional or x16 unidirectional)
Interchangeable with Halo™ mid-board optical transceivers using the same rugged surface mount connector
Low 6.5 m profile for space savings
Designed to withstand high shock and vibration with a rugged 2-piece contact system
34 AWG, 92 Ω Eye Speed Thinax™ ultra low skew twinax cable
Contact HDR@samtec.com for more information

IN DEVELOPMENT - Halo™ Rugged, High-Density Socket

High-density up to 76 pins in a single row around the perimeter (38 pins per side)
Allows for vertical mating with Halo™ optical and copper systems
Integrated locking latch mechanism simplifies mating/unmating of the cable assembly
Low profile with a 2-piece contact system designed to withstand high shock and vibration
Surface mount