High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCC, SFCF, SFCM-01, SFCM-02, SFOF, SFOM, Optics)
Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)
Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew
Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications
High-density mezzanine arrays feature 64 differential pairs per square inch
Routes an extremely high number of transmission lines from one PCB to the next
Surface mount reflow technology to the PCB
Contact HDR@samtec.com for more information
Also available: Si-Fly® HD 224 Gbps PAM4, high-density backplane cable solutions
Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector. The SFCM mounts directly to the package substrate and is pluggable with Samtec's SFCC cable assembly or an optical cable assembly of your choosing (contact HDR@samtec.com for more details).
Features
Evaluation and Development Kits
Si-Fly® Flyover® SI Evaluation Kit
As data rates increase, trace lengths on PCBs decrease. Samtec's high-speed, Flyover® solutions simplify PCB design and limit signal degradation in high data rate applications. The Si-Fly® Flyover® SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing the Si-Fly® 112 Gbps PAM4, Low-Profile High-Density Cable System. The Si-Fly® Flyover® SI Evaluation Kit (REF-224260-X.XX-XXX) routes eight high-speed differential pairs through Precision RF connectors, a Copper Si-Fly® Cable System and a Copper Si-Fly® High-Density Interconnect. The Si-Fly® Flyover® SI Evaluation Kit delivers a high-quality system with robust mechanical design. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.
Part Number: REF-224260-X.XX-XXX
Downloads & Resources
Literature
Technical Documents
Products
SFCC - IN DEVELOPMENT - Si-Fly® HD Co-Packaged Copper Cable Assembly
Features
Designed to mate with Si-Fly® HD Co-Packaged CPX Substrate Connectors (SFCM-02) and (SFCM-01)
224 Gbps PAM4 performance
170 differential pairs per square inch
Co-packaged for efficient signal routing and high density from the chip
Extremely high transmission line density using a low profile 10 mm mated height (4 row configuration)
8 differential pairs per row (4, 6 or 8 row configurations)
Eye Speed® Hyper Low Skew Twinax cable technology supports 224 Gbps PAM4 signaling (32 AWG)
Hyper low skew: 1.75 ps/meter max
Also available: Si-Fly® HD 224 Gbps PAM4, high-density backplane cable solutions
SFCM-01 - IN DEV – Si-Fly® HD Co-Packaged CPX Substrate Connector: Open CPX MSA Type 1
Features
Designed to mate with Si-Fly® HD Co-Packaged CPX Mezzanine Connector (SFCF) and Si-Fly® HD co-packaged cable assembly (SFCC-RA)
Also electrically pluggable with an optical cable assembly of your choosing (contact HDR@samtec.com for more details).
224 Gbps PAM4 performance
170 differential pairs per square inch
Routes an extremely high number of transmission lines from the chip
Integrated mechanical retention features
Surface mount reflow technology to the substrate
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
SFNC - IN DEVELOPMENT - Si-Fly® HD Near-Chip Cable Assembly
Features
Designed to mate with Si-Fly® HD near-chip board connector (SFNM)
224 Gbps PAM4 performance
64 differential pairs per square inch
Near-chip (ASIC-adjacent) cable system
Extreme high-density, right-angle and vertical cable launch
Eye Speed® Hyper Low Skew Twinax cable technology supports 224 Gbps PAM4 signaling (32 AWG)
Hyper low skew: 1.75 ps/meter max
Also available: Si-Fly® HD 224 Gbps PAM4, high-density backplane cable solutions
SFNM - IN DEVELOPMENT - Si-Fly® HD Near-Chip Board Connector
Features
Designed to mate with Si-Fly® HD near-chip cable assembly (SFNC)
224 Gbps PAM4 performance
64 differential pairs per square inch
Launches an extremely high number of transmission lines adjacent to the chip package
Integrated mechanical retention features
Surface mount reflow technology to the PCB
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
Also available: Si-Fly® HD 224 Gbps PAM4, high-density backplane cable solutions
SFCF - IN DEV – Si-Fly® HD Co-Packaged CPX Mezzanine Connector: Open CPX MSA Type 1
Features
Designed to mate with Si-Fly® HD Co-Packaged CPX Substrate Connector (SFCM-02)
224 Gbps PAM4 performance
Up to 64 differential pairs
Ultra-high I/O density needing only 14.7 mm of beachfront width
10 mm board-to-board stack height
Blind mate capable
Integrated polarization features
Rugged shrouded design
Full surface mount processing
Utilized in open CPX MSA type 1 applications
Targets AI optical scale-up infrastructure
SFCM-02 - IN DEV – Si-Fly® HD Co-Packaged CPX Substrate Connector: Open CPX MSA Type 1
Features
Designed to mate with Si-Fly® HD Co-Packaged CPX Mezzanine Connector (SFCF) and Si-Fly® HD Co-Packaged Copper Cable Assembly (SFCC-VT)
224 Gbps PAM4 performance
Up to 64 differential pairs
Ultra-high I/O density needing only 14.7 mm of beachfront width
10 mm board-to-board stack height
Blind mate capable
Integrated polarization features
Rugged shrouded design
Full surface mount processing
Utilized in open CPX MSA type 1 applications
Targets AI optical scale-up infrastructure
SFOF - IN DEV – Si-Fly® HD Optical Module Connector: Open CPX MSA Type 2
Features
Designed to mate with Si-Fly® HD Substrate Connector (SFOM)
224 Gbps PAM4 performance
Up to 120 differential pairs
Ultra-high I/O density needing only 16 mm of beachfront width
7 mm low profile stack height
Blind mate capable
Full surface mount processing
Single connector for signal and power
Utilized in open CPX MSA type 2 applications
Targets AI optical scale-up infrastructure
Robust alternative to compression interconnects
SFOM - IN DEV – Si-Fly® HD Optoelectronics Substrate Connector: Open CPX MSA Type 2
Features
Designed to mate with Si-Fly® HD Optical Module Connector (SFOF)
224 Gbps PAM4 performance
Up to 120 differential pairs
Ultra-high I/O density needing only 16 mm of beachfront width
7 mm low profile stack height
Blind mate capable
Full surface mount processing
Single connector for signal and power
Utilized in open CPX MSA type 2 applications
Targets AI optical scale-up infrastructure
Robust alternative to compression interconnects
Contact Sales
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