Si-Fly® LP is Samtec's lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware with performance to 112 Gbps PAM4.
The extremely low 4.35 mm profile allows Si-Fly® to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates and are PCIe® 6.0/CXL® 3.2 capable.
Si-Fly® LP allows for side-to-side and front-to-back PCB mounting near the IC package, with placement under heat sinks or other cooling hardware.
Samtec’s proprietary co-extruded, low loss Eye Speed® cable technology eliminates the performance limitations and inconsistencies of individually extruded dielectric twinax cabling, improving signal integrity, bandwidth and reach.
Extremely low 4.35 mm mated height (view mating details here)
Ideal for highly dense applications where z-axis height is limited
Near-chip (ASIC-adjacent) cable system
Multiple connectors can be used side-to-side, front-to-back or in a belly-to-belly configuration
34 AWG, 92 or 100 Ω Eye Speed® ultra low skew twinax cable
112 Gbps PAM4 per lane
16 pair aggregate data rate: 896 Gbps (x8, bi-directional) or 1.79 Tbps (x16, uni-directional)
Rugged swing latch for positive retention
Operating temperature: -25 ˚C to +85 ˚C
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
In development options: 8-pair with 3.05 mm mated height, 34 AWG Thinax™ cable, 105 ˚C operating temp
Extremely low 4.35 mm mated height (view mating details here)
Ideal for highly dense applications where z-axis height is limited
Near-chip (ASIC-adjacent) cable system
Surface mount termination
Multiple connectors can be used side-to-side, front-to-back or in a belly-to-belly configuration
112 Gbps PAM4 per lane
16 pair aggregate data rate: 896 Gbps (x8, bi-directional) or 1.79 Tbps (x16, uni-directional)
Operating temperature: -25 ˚C to +85 ˚C
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
In development options: 8-pair with 3.05 mm mated height, 34 AWG Thinax™ cable, 105 ˚C operating temp
