The extremely low 4.0 mm profile allows Si-Fly™ to be placed adjacent to the IC package and under heat sinks or other cooling hardware for design flexibility. The high-density 8 or 16 pair configurations offer optimal solutions for routing 4 or 8 channels at 112 Gbps PAM4 data rates and are PCIe® 6.0/CXL® 3.1 capable.
Si-Fly® LP is Samtec's lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware with performance to 112 Gbps PAM4.
Family Overview
Features
Ultra Low Profile
- Up to 16 pairs in an incredibly low 4 mm profile
- Minimum 8.4 mm height required for mating
Extreme Channel Performance
112 Gbps PAM4 per lane enabling 25.6 TB aggregate with a path to 51.2 TB
~5x the reach, compared to traditional PCB
Copper Si-Fly™ LP 22-inch reach versus PCB 4.5-inch reach.
Si-Fly™ LP offers longer reach and better performance, compared to traditional PCB topology.
Downloads & Resources
Literature
Products
CPC
Features
Ultra-low profile interconnect adjacent to the IC package
Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
112 Gbps PAM4 per lane
5x the reach of traditional PCB solutions
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
CPI
Features
Ultra-low profile interconnect adjacent to the IC package
Ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB
112 Gbps PAM4 per lane
5x the reach of traditional PCB solutions
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
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