High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
Co-packaged offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density
Eye Speed AIR™ cable technology provides the lowest dK possible using a uniformly foamed dielectric (33 AWG)
Hyper low skew: 1.75 ps/meter max
Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications
Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market, with both vertical and right-angle cable launches.
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SFCC
IN DEVELOPMENT - Si-Fly® HD Co-Packaged Cable Assembly
Features
224 Gbps PAM4 performance
170 differential pairs per square inch
Co-packaged for efficient signal routing and high density from the chip
Extremely high transmission line density using a low profile 10 mm mated height (4 row configuration)
8 differential pairs per row (4, 6 or 8 row configurations)
Eye Speed AIR™ cable technology provides the lowest dK possible using a uniformly foamed dielectric (33 AWG)
Hyper low skew: 1.75 ps/meter max
SFCM
IN DEVELOPMENT - Si-Fly® HD Co-Packaged Substrate Connector
Features
Designed to mate with Si-Fly® HD co-packaged cable assembly (SFCC)
224 Gbps PAM4 performance
170 differential pairs per square inch
Routes an extremely high number of transmissions lines from the chip
Integrated mechanical retention features
Surface mount reflow technology to the substrate
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
SFNC
IN DEVELOPMENT - Si-Fly® HD Near-Chip Cable Assembly
Features
224 Gbps PAM4 performance
64 differential pairs per square inch
Near-chip (ASIC-adjacent) cable system
Extreme high-density, right-angle and vertical cable launch
Eye Speed AIR™ cable technology provides the lowest dK possible using a uniformly foamed dielectric (33 AWG)
Hyper low skew: 1.75 ps/meter max
SFNM-L
IN DEVELOPMENT - Si-Fly® HD Near-Chip Board Connector
Features
Designed to mate with Si-Fly® HD near-chip cable assembly (SFNC)
224 Gbps PAM4 performance
64 differential pairs per square inch
Launches an extremely high number of transmission lines adjacent to the chip package
Integrated mechanical retention features
Surface mount reflow technology to the PCB
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
Contact Sales
More Flyover® Next-Gen Systems
- Flyover® SFP/QSFP/OSFP Cable Systems
- NovaRay® I/O Panel Mount Cable System
- ExaMAX® I/O
- NovaRay® 112 Gbps PAM4, Extreme Density Arrays
- AcceleRate® HP Extreme Density Cable System
- AcceleRate® Slim Direct Attach Cable Assemblies
- AcceleRate® Mini
- Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems
- Si-Fly® LP 112 Gbps PAM4, Low Profile High-Density Cable Assembly
- FireFly™ Optical Transceivers
- Halo™ Next Gen Mid-Board Optical Transceivers
- High-Speed 0.60 mm Pitch Edge Card Cable Assemblies
- NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System
- ExaMAX® High-Speed Backplane System
