High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCM, SFCC, Optics)
Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)
Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew
Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications
High-density mezzanine arrays feature 64 differential pairs per square inch
Routes an extremely high number of transmission lines from one PCB to the next
Surface mount reflow technology to the PCB
Contact HDR@samtec.com for more information
Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector. The SFCM mounts directly to the package substrate and is pluggable with Samtec's SFCC cable assembly or an optical cable assembly of your choosing (contact HDR@samtec.com for more details).
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SFCC
Features
224 Gbps PAM4 performance
170 differential pairs per square inch
Co-packaged for efficient signal routing and high density from the chip
Extremely high transmission line density using a low profile 10 mm mated height (4 row configuration)
8 differential pairs per row (4, 6 or 8 row configurations)
Eye Speed® Hyper Low Skew Twinax cable technology supports 224 Gbps PAM4 signaling (32 AWG)
Hyper low skew: 1.75 ps/meter max
SFCM
Features
Designed to mate with Si-Fly® HD co-packaged cable assembly (SFCC)
Also electrically pluggable with an optical cable assembly of your choosing (contact HDR@samtec.com for more details).
224 Gbps PAM4 performance
170 differential pairs per square inch
Routes an extremely high number of transmission lines from the chip
Integrated mechanical retention features
Surface mount reflow technology to the substrate
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
SFNC
Features
224 Gbps PAM4 performance
64 differential pairs per square inch
Near-chip (ASIC-adjacent) cable system
Extreme high-density, right-angle and vertical cable launch
Eye Speed® Hyper Low Skew Twinax cable technology supports 224 Gbps PAM4 signaling (32 AWG)
Hyper low skew: 1.75 ps/meter max
SFNM-L
Features
Designed to mate with Si-Fly® HD near-chip cable assembly (SFNC)
224 Gbps PAM4 performance
64 differential pairs per square inch
Launches an extremely high number of transmission lines adjacent to the chip package
Integrated mechanical retention features
Surface mount reflow technology to the PCB
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
SFBF
Features
Designed to mate with Si-Fly® HD mezzanine terminal (SFBM)
224 Gbps PAM4 performance
64 differential pairs per square inch
Routes an extremely high number of transmission lines from one PCB to the next
Surface mount reflow technology to the PCB
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
SFBM
Features
Designed to mate with Si-Fly® HD mezzanine socket (SFBF)
224 Gbps PAM4 performance
64 differential pairs per square inch
Routes an extremely high number of transmission lines from one PCB to the next
Surface mount reflow technology to the PCB
Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group
Operating temperatures supporting -55 °C to +125 °C
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More Flyover® Next-Gen Systems
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- AcceleRate® HP Extreme Density Cable System
- AcceleRate® Slim Direct Attach Cable Assemblies
- AcceleRate® Mini
- Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems
- Si-Fly® LP 112 Gbps PAM4, Low Profile High-Density Cable Assembly
- FireFly™ Optical Transceivers
- Halo® Next Gen Mid-Board Optical Transceivers
- High-Speed 0.60 mm Pitch Edge Card Cable Assemblies
- NovaRay® 128 Gbps PAM4 Micro Rugged Backplane System
- ExaMAX® High-Speed Backplane System
