Samtec delivers Sudden Service® solutions for standard and customer-specific automotive designs by providing short lead times with an array of options to meet the robust quality, production and compliance requirements of our customers. Our automotive interconnect systems are ideal for applications requiring high-performance, high-density, high-reliability/high mating cycles, optics and microelectronics solutions, with PPAP options.
Standard Catalog Product
Custom ACD-Series
A-Series for Automotive
.050" (1.27mm) x .050" (1.27mm) pitch board-to-board terminal and socket strips in a variety of board stacking heights, orientations and contact styles.
Series up to 10,000 cycles
Wide array of board stacking heights
Various mating orientations
Rugged options
Numerous contact styles
Stack heights .235" (5.91 mm) - .754" (19.15 mm)
Available up to 100 pins
Tiger Eye™ high-cycle, high-reliability connector systems feature Samtec's most rugged contact system rated to 1,000+ mating cycles in 0.80 mm, 1.27 mm and 2.00 mm pitches, with a variety of ruggedizing options.
High-reliability Tiger Eye™ three-finger BeCu contact system
Choice of 0.80 mm, 1.27 mm and 2.00 mm pitch
Optional locking and latching systems for higher withdrawal force
Standard and cost-saving designs
Extended Life Product™ testing available
Severe Environment Testing (SET) available (Visit samtec.com/set)
Discrete wire cable assemblies, components and tooling available
High-speed, high-density Razor Beam™ self mating connectors reduce inventory costs and are available in a variety of pitches and lead styles for increased flexibility.
0.50 mm, 0.635 mm or 0.80 mm pitch systems
Razor Beam™ contacts for high-speed and fine-pitch systems
Mating and unmating forces approximately 4-6x greater than typical micro pitch connectors
Shielded option for EMI protection
Self-mating connectors reduce inventory costs and can be interchanged for varying stack heights
10 stack height options from 5 mm to 12 mm
Up to 100 contacts
Parallel, perpendicular and coplanar systems
Audible click when mated
Lubricated option available
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
56 Gbps PAM4 performance
Up to 560 I/Os in open pin field design
1.27 mm (.050") pitch
Rugged Edge Rate® contact system
Can be “zippered” during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product™ (E.L.P.™) standards
Analog Over Array™ capable
7–18.5 mm stack heights
Vertical, right-angle, press-fit
Elevated systems to 40 mm
85 Ω systems
Standards: VITA™ 47, VITA™ 57.1 FMC™, VITA™ 57.4 FMC+™, VITA™ 74 VNX™, PISMO™ 2
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
These 0.80 mm pitch high-density arrays feature an open-pin-field for up to 50% board space savings.
0.80 mm (.0315") pitch grid
50% board space savings versus .050" (1.27 mm) pitch arrays
28 Gbps NRZ/56 Gbps PAM4 performance
Rugged Edge Rate® contact system
Up to 500 I/Os
7 mm and 10 mm stack heights
Solder charge terminations for ease of processing
Final Inch® certified for Break Out Region trace routing recommendations
Analog Over Array™ capable
One product family that supports board-to-board, cable-to-board and cable-to-cable applications
Up to 18 A per blade
40% space savings compared to traditional power systems
2–10 power blades on a 2.00 mm pitch
5 mm to 16 mm, 18 mm & 20 mm stack heights
Discrete wire cable assemblies, with rugged latching, simplify board layout and deliver power directly to active components in the system
These Micro Blade & Beam 0.40 mm & 0.50 mm fine pitch connectors feature an ultra slim, ultra low profile for increased board space savings.
Ultra fine pitch – 0.40 mm and 0.50 mm
Ultra low stack down to 2.00 mm
Slim body design for increased board space savings
Samtec's Generate® 0.80 mm pitch edge card sockets feature Edge Rate® contacts optimized for signal integrity performance. Available in vertical, right-angle, edge mount, pass-through and power/signal combo for design flexibility.
56 Gbps PAM4 performance
Rugged Edge Rate® contacts
Card slot: 1.60 mm (.062")
Single-ended and differential pairs
Vertical, right-angle, edge mount
Optional board locks and cable latching features
Optional weld tab for mechanical strength
RU8 system for elevated board stacking
Samtec uses proven processes that meet our IATF 16949 certification. Samtec designates these products with an A-Series part number. For each A-Series product, a customer will receive a Level 3 Product Part Approval Process (PPAP) package.
Initiative to test products beyond typical standards for extreme applications
Rigorous testing to evaluate contact resistance in simulated storage/field conditions
All Samtec series undergo Design Qualification Testing
