DATACOM

High-Density, High-Speed Interconnects

AI/ML

Artificial intelligence and machine learning (AI/ML) data center implementations require new topologies with increased throughput, density, flexibility and scalability. To meet these challenges, Samtec offers a range of high-performance interconnects ideal for supporting next-generation AI/ML topologies via AI accelerators and domain specific architectures (DSAs). For the designer, Samtec offers full-system optimization support with industry-leading signal integrity design expertise; characterization and development boards; and online design and development tools. Explore the solutions below or download the Artificial Intelligence Solutions Guide to see how Samtec products can support your design.

Matt Burns

Datacom Industry Expert

Matt Burns - Datacom Industry Expert Video
 

AI/ML SOLUTIONS

A wide variety of Samtec interconnect solutions are available to support AI/ML designs:

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