AI/ML, 5G/6G, and Industry 4.0 deployments are exponentially increasing the stress on global data infrastructure. Samtec delivers high-performance, high-density interconnect solutions, such as the Si-Fly HD® co-packaged and near chip systems, for data communications designs. Samtec's board-to-board, board-to-cable, optical, and high frequency interconnects provide industry-leading performance for applications up to 448 Gbps, and everything in between. Samtec Sudden Service® provides customers with access to signal integrity experts, development kits, and modules, such as the Fireblade™ FireFly™ OCP OAI EXP Module, to optimize their latest datacom system designs. Explore the applications below to see how Samtec can help you speed time to market for your next datacom design.
Here are some reasons why customers select Samtec interconnects:
Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector. The SFCM mounts directly to the package substrate and is pluggable with Samtec's SFCC cable assembly or an optical cable assembly of your choosing (contact HDR@samtec.com for more details).
High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCC, SFCF, SFCM-01, SFCM-02, SFOF, SFOM, Optics)
Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)
Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew
Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications
High-density mezzanine arrays feature 64 differential pairs per square inch
Routes an extremely high number of transmission lines from one PCB to the next
Surface mount reflow technology to the PCB
Contact HDR@samtec.com for more information
Also available: Si-Fly® HD 224 Gbps PAM4, high-density backplane cable solutions
Si-Fly® LP is Samtec's lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware with performance to 112 Gbps PAM4.
Up to 16 pairs in an incredibly low 4.35 mm profile
Near-chip (ASIC-adjacent) cable system
Ideal for highly dense applications where z-axis height is limited
112 Gbps PAM4 performance per lane
Eludes the BGA and routes signals directly from the silicon package through a long-reach cable
Samtec's XCede® HD high-density backplane system features a small form factor ideal for density-critical applications, and a modular design for flexibility and customizable solutions.
Small form factor provides significant space savings
Modular design provides flexibility in applications
High-density backplane system – up to 84 differential pairs per linear inch
1.80 mm column pitch
3-, 4- and 6-pair designs
4, 6 or 8 columns
12–48 pairs
Up to a 3.00 mm contact wipe on signal pins
Multiple signal/ground pin staging options
Integrated power, guidance, keying and side walls available
85 Ω and 100 Ω options
Three levels of sequencing enable hot plugging
Cost-effective designs available for low-speed applications
Power modules (HPTT/HPTS) are available as a standalone power solution with 10 Amps max per blade
NovaRay® combines extreme density and performance for 128 Gbps PAM4 per channel in 40% less space than traditional arrays.
128 Gbps PAM4 per channel
4.0 Tbps aggregate data rate - 9 IEEE 400G channels
Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control
Two points of contact ensure a more reliable connection
92 Ω solution addresses both 85 Ω and 100 Ω applications
Analog Over Array™ capable
NovaRay® I/O uses Flyover® cable technology to route up to 4,096 Gbps PAM4 aggregate data from the IC package to the panel and beyond, and is available in a rugged 38999 shell.
Highest aggregate data rate on the market - 4,096 Gbps PAM4
128 Gbps PAM4 per channel
16 & 32 diff pair configurations; accommodates PCIe® x4 or x8 plus sidebands
Cable-to-cable bulkhead or threaded 38999 panel connection using Flyover® cable technology
Rugged 38999 shell is salt fog resistant to 48 hours with an IP67 sealed option (NVA3E/NVA3P)
External Cable: 28 or 34 AWG ultra low skew twinax
Internal Cable: 34 AWG ultra low skew twinax or Thinax™
Single-ended ThinSE™ coax options also available
Full external EMI shielding
Multiple end 2 high-speed connector options available for your ASIC-adjacent Flyover® interconnect
NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 128 Gbps PAM4.
Ultra-high density with up to 128 differential pairs in a single connector
128 Gbps PAM4 performance per channel
Supports blind mate applications
Surface mount for better density and performance
Offset footprint for optimum signal integrity
Flyover® cable assembly in design
AcceleRate® HP 0.635 mm pitch arrays feature 112 Gbps PAM4 extreme performance and a flexible open-pin-field design.
0.635 mm pitch open-pin-field array
56 Gbps NRZ/112 Gbps PAM4 performance
Cost optimized solution
Low-profile 5 mm and up to 10 mm stack heights
Up to 800 total pins available; roadmap to 1,000+ pins
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
Analog Over Array™ capable
AcceleRate® HP cable assembly is the industry’s highest density 112 Gbps PAM4 rated solution for near-chip cable-to-board applications or co-packaged (direct-to-chip package) solutions.
Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system or co-packaged (direct-to-chip package) solution
Near-chip solution overcomes the challenges of launching a high number of transmission lines off the board close to the chip (ARP6, APF6-L/APF6-T/APF6-S/APF6-RA-S)
Co-packaged (direct-to-chip package) solution offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (ART6, ATF6)
Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE
32 to 96 differential pairs
4, 6 or 8 rows
34 AWG Eye Speed Thinax™ ultra low skew twinax cable, or 34 AWG Eye Speed ThinSE™ thin micro coax cable
Eye Speed Thinax™ cable technology provides overall weight reduction and maximizes airflow, making it easy to route through systems; ultra low skew 3.5 ps/meter max
Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
Right-angle mating board connectors available with panel mount cage (APF6-RA/APF6-C) or mid-board shield (APF6-RA-S)
Ideal for AI, high-performance computing (HPC) and data center applications
Samtec's FireFly™ Micro Flyover System™ embedded and rugged mid-board optical transceivers take data connection "off board" for up to 28 Gbps per lane with a path to 112 Gbps PAM4 via optical cable at greater distances, or copper for cost optimization.
High-speed performance to 28 Gbps per lane
x4 and x12 designs
Interchangeability of copper and optical
Variety of integral heat sink and End 2 options
Micro rugged two-piece connector
Extended temperature and PCIe®-Over-Fiber solutions
These direct attach Flyover® SFP/QSFP/OSFP cable assemblies route critical high-speed signals through Eye Speed® ultra low skew twinax for improved and extended signal integrity.
4 or 8 channel systems
Eye Speed® 100 ohm twinax cable
Press-fit tails for low speed signals/power to PCB
No re-timers required for reduced cost and power consumption
Improved thermal dissipation by allowing ICs to be placed in preferred locations
Belly-to-belly mating for maximum density (FQSFP-DD Series)
Multiple end 2 options available
Compatible with all MSA QSFP pluggables
These 0.635 mm pitch high-density, high-speed signal/power arrays achieve 64 Gbps PAM4 speeds and feature rotated power blades for improved performance and simplified breakout region (BOR).
Best in class density for power and signal
Power blades rotated 90º gives equal access to heat escape for uniform cooling, increased current capacity and reduced crowding
Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
Open-pin-field design for maximum grounding and routing flexibility
High-density multi-row design
Low profile 5 mm and 10 mm stack heights; up to 16 mm on roadmap
4, 6, 8 or 10 total power blades
60, 120, 180 or 240 total signal positions
0.635 mm signal pitch
Optional alignment pins
Standard weld tabs for a secure connection to the board
Polarized guide posts for blind mating
One product family that supports board-to-board, cable-to-board and cable-to-cable applications
Up to 18 A per blade
40% space savings compared to traditional power systems
2–10 power blades on a 2.00 mm pitch
Available in surface mount and through-hole tails
5 mm to 16 mm, 18 mm & 20 mm stack heights
Optional weld tabs, through-hole or surface mount
Discrete wire cable assemblies, with rugged latching, simplify board layout and deliver power directly to active components in the system
All Samtec series undergo Design Qualification Testing
Rigorous testing to evaluate contact resistance in simulated storage/field conditions
Initiative to test products beyond typical standards for extreme applications
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