Provides low-latency, protocol agnostic, 1.6 Tbps aggregate throughput in a
compact form factor ideal for AI/ML system topologies
Overview
Samtec's FireBlade™ FireFly™ OCP OAI EXP Module provides 1.6 Tbps aggregate throughput. The module supports Data Center, HPC, and FPGA-to-FPGA protocols including Ethernet, InfiniBand™, Fibre Channel, PCI Express®, and CXL®. It typically requires half the power of MSA-style optics. Each OCP OAI Universal Baseboard (UBB) can accommodate up to eight FireBlade™ FireFly™ OCP OAI EXP Modules.
The FireBlade™ FireFly™ OCP OAI EXP Module also incorporates US Conec MMC optical connectors which provide 3x cabling port density over the MPO format helping achieve expanded fiber density in the EXP module form factor.
Features
- OCP OAI EXP Module form factor
- Sixteen FireFly™ two-piece SMT connector systems (UCC8/UEC5-2 series)
- Uses sixteen 25 Gbps x 4 Samtec FireFly™ optical transceivers with 1.6 Tbps aggregate throughput
- Typically requires half the power of MSA style optics
- 2.36 mm gold finger PCB design for attaching to SFF-TA-1002 2C connector located on UBB
- Contains two 4x16 ExaMAX2® connectors for SerDes interconnection
- Contains four MMC 4-Port Adaptors enabling connections to sixteen MMC optical connectors
EXAMAX® and EXAMAX2® are registered trademarks of Amphenol FCI Asia Pte. Ltd. Used with permission.
Applications
- Artificial Intelligence
- Machine Learning
- Deep Learning
- High Performance Computing
- Servers
- Data Center
- ASIC Development
Ordering Information
Contact KitsAndBoards@Samtec.com for additional ordering information.
