DATACOM

High-Density, High-Speed Interconnects

Memory/Storage

Double-data rate memory technology enables better power, density, and transfer speeds in HPC, AI, servers, and other datacom applications. Emulating, prototyping, and testing the latest memory chips and chiplets for signal integrity is challenging, because of signal density, high-speeds, compact form factors, and PCB stack-up requirements. Samtec has developed high-performance interconnects, such as the Generate® product line for use on DDR/LPDDR IC characterization cards and the Bulls Eye® test assembly series, to help memory developers improve the performance of their chips. Inside the datacenter, Samtec's CXL®-Over-Optics solutions enable low-latency links and memory coherency between computing devices.

Liam Parkes

Datacom Industry Expert

Liam Parkes - Datacom Industry Expert Video
 

MEMORY/STORAGE SOLUTIONS

A wide variety of Samtec interconnect solutions are available to support memory and storage related needs:

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