Samtec delivers Sudden Service® solutions for standard and application-specific military and aerospace designs to meet the stringent quality, production and compliance requirements of our customers. The combined efforts of Samtec's on-going Severe Environment Testing initiative with our extremely flexible high-speed interconnects provides a quick turn and cost-effective solution for military and aerospace applications that require reliable performance and durability.
Ask us about Samtec's lot sample screening per EIA-364 (meets or exceeds MIL-DTL-55302). Contact mapsales@samtec.com.
COMMERCIAL OFF-THE-SHELF (COTS)
MILITARY/AEROSPACE PRODUCT (MAP)
APPLICATION SPECIFIC PRODUCT (ASP)
Tiger Eye™ high-cycle, high-reliability connector systems feature Samtec's most rugged contact system rated to 1,000+ mating cycles in 0.80 mm, 1.27 mm and 2.00 mm pitches, with a variety of ruggedizing options.
High-reliability Tiger Eye™ three-finger BeCu contact system
Choice of 0.80 mm, 1.27 mm and 2.00 mm pitch
Optional locking and latching systems for higher withdrawal force
Standard and cost-saving designs
Extended Life Product™ testing available
Severe Environment Testing (SET) available (Visit samtec.com/set)
Discrete wire cable assemblies, components and tooling available
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
56 Gbps PAM4 performance
Up to 560 I/Os in open pin field design
1.27 mm (.050") pitch
Rugged Edge Rate® contact system
Can be “zippered” during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product™ (E.L.P.™) standards
Analog Over Array™ capable
7–18.5 mm stack heights
Vertical, right-angle, press-fit
Elevated systems to 40 mm
85 Ω systems
Standards: VITA™ 47, VITA™ 57.1 FMC™, VITA™ 57.4 FMC+™, VITA™ 74 VNX™, PISMO™ 2
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
Razor Beam™ self mating high speed rugged cables come in vertical or right angle options and offer rugged screw down options for added reliability
50 ohm single-ended signal routing
38 AWG micro ribbon coax cable
Rugged screw down option
Vertical or right-angle end options
0.50 mm (.0197") pitch
AcceleRate® is the industry's slimmest cable system with direct attach technology and ultra low skew twinax cable for 64 Gbps PAM4 (32 Gbps NRZ) speeds and PCIe® 6.0/CXL® 3.2 capable.
Incredibly slim 7.6 mm width
High-density 2-row design
Supports 64 Gbps PAM4 (32 Gbps NRZ) applications
8, 16 and 24 differential pair options available
16 differential pair option can support PCIe® x4 plus sidebands
24 differential pair option can support PCIe® x8 plus sidebands
34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable
Improved signal integrity by eliminating transition board and its variability
Mating board level socket (ARF6 Series) features standard rugged weld tabs for increased stability on the PCB
Rugged metal latching and shielding
“Reversed Polarity” pinout option for reduced Far-End Crosstalk
One product family that supports board-to-board, cable-to-board and cable-to-cable applications
Up to 18 A per blade
40% space savings compared to traditional power systems
2–10 power blades on a 2.00 mm pitch
5 mm to 16 mm, 18 mm & 20 mm stack heights
Discrete wire cable assemblies, with rugged latching, simplify board layout and deliver power directly to active components in the system
URSA® I/O features a hyperboloid-type contact for extreme reliability and high mating cycles in ultra rugged applications with EMI protection.
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
In Development: Variety of contacts available in the rugged URSA® I/O housing - micro-miniature/push-on SMPM style, high-performance AcceleRate®, power, and combinations in 1 to 5 banks
Current rating: 3.8 A max
Voltage rating: 200 VAC/282 VDC max
Micro 1.00 mm pitch in double row space saving design
Extreme density with up to 1,450 total I/Os in a 1RU panel (29 cables at 50 total I/Os each)
Cable-to-cable and cable-to-board solutions
EMI shielding to limit signal degradation and optimize performance
Samtec's FireFly™ Micro Flyover System™ embedded and rugged optical transceivers take data connection "off board" for up to 28 Gbps per lane with a path to 112 Gbps PAM4 via optical cable at greater distances, or copper for cost optimization.
High-speed performance to 28 Gbps per lane
x4 and x12 designs
Interchangeability of copper and optical
Variety of integral heat sink and End 2 options
Micro rugged two-piece connector
Extended temperature and PCIe®-Over-Fiber solutions
Ganged, multi-port RF blocks and cable assemblies for millimeter wave applications. Ideal when space is limited and a high operating frequency is required.
High-density, space-saving design
Push-on interface with varying retention forces
Ganged, SMPM connectors: operate mode-free up to 65 GHz
Micro-miniature SMPM style enables smaller bundle sizes for weight savings and increased airflow
50 ohm impedance
Cable-to-board and board-to-board solutions
Bullet adaptors allow for axial and radial misalignment, and blind mate
Initiative to test products beyond typical standards for extreme applications
Rigorous testing to evaluate contact resistance in simulated storage/field conditions
All Samtec series undergo Design Qualification Testing
