URSA® I/O features a hyperboloid-type contact for extreme reliability and high mating cycles in ultra rugged applications with EMI protection.
Samtec’s URSA® I/O cable-to-cable and cable-to-board solutions achieve four points of contact for a reliable connection in a small form factor, which allows for extreme density on the panel. Designed for ultra rugged applications, EMI shielding helps to limit signal degradation and optimize performance.
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
28 or 30 AWG Teflon™ fluoropolymer wire
Teflon™ is a trademark of The Chemours Company FC, LLC used under license by Samtec
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
28 or 30 AWG Teflon™ fluoropolymer wire
End 2 options
Teflon™ is a trademark of The Chemours Company FC, LLC used under license by Samtec
Hot swap option available
Through-hole or surface mount
Double row design, up to 40 positions per row
Micro 1.00 mm (.0394") pitch
10, 15, 35 & 30 pins on a 1.00 mm (.0394”) pitch
Required for use with IBT1 socket housing
10, 15, 35 & 30 pins on a 1.00 mm (.0394”) pitch
Required for use with IPP1 terminal housing
28 or 30 AWG PVC wire with color-coded option available
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
28 or 30 AWG PVC wire with color-coded option available
End 2 options
Four points of contact for an extremely reliable connection
Hyperboloid-type contact for extreme high mating cycles
Micro 1.00 mm (.0394") pitch
Double row design, up to 40 positions per row
