Overview
The new VITA™ 93 Standard defines a flexible, next-generation mezzanine concept for small form factor modules. This new standard enables modular, scalable design with rugged and reliable mechanical features. It supports both air and conduction cooling for both front and rear I/O systems. QMC™ mezzanines support 32 Gbps NRZ/64 Gbps PAM4 performance in various carrier card form factors including 3U/6U Eurocards (VPX, cPCI, cPCIe, VME, etc.), VNX+™, PCIe® expansion cards, and others.

VITA™ 93
The VITA™ 93 Standard relies on the high-speed capabilities and the slim, dense design of Samtec’s AcceleRate® HD Ultra-Dense, Slim Body Arrays. The 80-pin (4 x 20) QMC™ Connectors are available in 9 mm, 11 mm, 14 mm, and 16 mm stack heights. The QMC™ Carrier Connector is used for both host (Jx1) and I/O (Jx2) connections. QMC™ supports single-width, dual-width, and triple-width modules.
Samtec PN | Connectors | Options | Design Support | ||||||||
---|---|---|---|---|---|---|---|---|---|---|---|
Socket (Module Connector) |
Terminal (Carrier Connectors) |
Solder Ball Type |
Alignment Pin (-A) |
Tape & Reel (-TR) |
Prints | 3D | PADS | ||||
Standard | 9 mm Mated | 11 mm Mated | 14 mm Mated | 16 mm Mated | |||||||
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