Innovations in Copackaged Interconnects for 224 Gbps PAM4 (Samtec DesignCon 2026)

Name: Innovations in Copackaged Interconnects for 224 Gbps PAM4 (Samtec DesignCon 2026)
Uploaded: 2026-03-23T20:38:40+00:00
Duration: 145S
Description: AI was the catalyst for many products and technologies demonstrated in exhibitor booths and discussed in technical reviews, tutorials, and presentations at DesignCon 2026. Samtec presented several live product demonstrations showcasing our 224 Gbps PAM4 and 448 Gbps interconnect solutions. These demonstrations incorporated our Si-Fly® HD cable solutions.

AI was the catalyst for many products and technologies demonstrated in exhibitor booths and discussed in technical reviews, tutorials, and presentations at DesignCon 2026. Samtec presented several live product demonstrations showcasing our 224 Gbps PAM4 and 448 Gbps interconnect solutions. These demonstrations incorporated our Si-Fly® HD cable solutions.