Nokia Bell Labs, Northrop Grumman, Samtec Partner to Create RoG + GaN on Glass Modules

Nokia Bell Labs (NBL) is leveraging Samtec glass core technology (GCT) as a platform for custom-designed silicon devices. NBL developed an electronics assembly on glass package with multiple interconnect and chips to realize a full radio on glass (RoG). To increase the reach of their E-band radio, they partnered with Northrop Grumman, which is utilizing new GaN technology to provide more RF power at E-band. From Northrop Grumman, we see two 90-nanometer GaN circuits combined on the glass substrate. The glass interposer provides a very high-performance interconnect at these high frequencies, enables compact designs, and provides thermal management for the chips.