These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
Samtec's SEARAY™ products are the industry's largest offering of high-speed, high-density open-pin-field arrays. They support 56 Gbps PAM4 applications and are also Final Inch® certified for Break Out Region trace routing recommendations to save designers time and money.
Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
56 Gbps PAM4 performance
Up to 560 I/Os in open pin field design
1.27 mm (.050") pitch
Rugged Edge Rate® contact system
Can be “zippered” during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product™ (E.L.P.™) standards
Analog Over Array™ capable
7–18.5 mm stack heights
Vertical, right-angle, press-fit
Elevated systems to 40 mm
85 Ω systems
Standards: VITA™ 47, VITA™ 57.1 FMC™, VITA™ 57.4 FMC+™, VITA™ 74 VNX™, PISMO™ 2
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
SEARAY™ open-pin-field design gives customers the ability to simultaneously run differential pairs, single-ended signals and power though the same 56 Gbps PAM4 interconnect.
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Analog Over Array™ capable
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Up to 500 I/Os
Rugged Edge Rate® contact
56 Gbps PAM4 performance
SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
Extended Life Product™ certified to 5,000 cycles and 150º operating temperature with SureCoat™ palladium nickel with gold flash plating. See E.L.P.™ test report.
.050" (1.27 mm) pitch
Stack heights from 7 mm to 18.5 mm
Lower insertion/withdrawal forces
Solder charge termination
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Analog Over Array™ capable
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
Up to 500 I/Os
Rugged Edge Rate® contact
56 Gbps PAM4 performance
SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
Extended Life Product™ certified to 5,000 cycles and 150º operating temperature with SureCoat™ palladium nickel with gold flash plating. See E.L.P.™ test report.
.050" (1.27 mm) pitch
Lower insertion/withdrawal forces
Solder charge termination
Stack heights from 7 mm to 18.5 mm
Solder charge termination
Guide post, latching post options
High-density open-pin-field array
Right-angle design
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge terminations
Guide post, latching post options
High-density open-pin-field array
Right-angle design
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Lower insertion/withdrawal forces
Rugged Edge Rate® contact
High-density open-pin-field array
Press-fit tails
7 mm, 8 mm, 8.5 mm and 9.5 mm stacks
Lower insertion/withdrawal forces
Rugged Edge Rate® contact
High-density open-pin-field array
Press-fit tails
7 mm to 16 mm stack heights
Lower insertion/withdrawal forces
Rugged Edge Rate® contact
High-density open-pin-field array
Press-fit tails
Right-angle
85 ohm
SEARAY™ riser
Up to 40.00 mm stack
85 ohm tuned
High-density open-pin-field array
Performance to 14 Gbps
Works as a traditional standoff
Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF, ADM6/ADF6 and other high-normal-force connectors
Reduces risk for component damage on boards
Board stacks from 4.00 mm to 16.00 mm
Press-fit and threaded bases available
Accommodates blind mating in perpendicular applications
Mates with GPSK guide post socket
Pairs with most high-speed connector strips and arrays
Accommodates blind mating in perpendicular applications
Mates with GPPK Series guide post
Use with PCB thickness of .062" (1.60 mm) to .125" (3.18 mm)
Pairs with most high-speed connector strips and arrays
