
These high-speed, high-density open-pin-field arrays allow maximum grounding and routing flexibility.
Family Overview

Features
Features
Maximum routing and grounding flexibility
Lower insertion/extraction forces vs. typical array products
56 Gbps PAM4 performance
Up to 560 I/Os in open pin field design
1.27 mm (.050") pitch
Rugged Edge Rate® contact system
Can be “zippered” during mating/unmating
Solder charge terminations for ease of processing
Meets Extended Life Product™ (E.L.P.™) standards
Analog Over Array™ capable
7–18.5 mm stack heights
Vertical, right-angle, press-fit
Elevated systems to 40 mm
85 Ω systems
Standards: VITA™ 47, VITA™ 57.1 FMC™, VITA™ 57.4 FMC+™, VITA™ 74 VNX™, PISMO™ 2
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products (SEAM/SEAF series only)

SEARAY™ SI Evaluation Kit
Samtec's SEARAY™ product family offers the industry’s largest portfolio of high-speed, high-density open-pin-field arrays. The SEARAY™ SI Evaluation Kit provides system designers and SI engineers an easy-to-use solution for testing a number of SEARAY™ connectors in mezzanine, coplanar and right-angle configurations. The SEARAY™ SI Evaluation Kit (REF-219213-X.XX-01) delivers a high-quality system of four PCBs with robust mechanical design. Please contact Samtec’s technical experts at KitsAndBoards@samtec.com for additional information.
Part Number: REF-219213-X.XX-01

SEARAY™ Analog Over Array™ SI Evaluation Kit
Samtec's SEARAY™ product family offers the industry's largest portfolio of high-speed, high-density open-pin-field arrays. The SEARAY™ Analog Over Array™ SI Evaluation Kit provides system designers, SI engineers and RF engineers an easy-to-use solution for testing the RF capabilities of SEARAY™ connectors. The SEARAY™ Analog Over Array™ SI Evaluation Kit (REF-231562-X.XX-XX) delivers a high-quality system of two PCBs with robust mechanical design. Please contact Samtec's technical experts at KitsandBoards@samtec.com for additional information.
Part Number: REF-231562-X.XX-XX

VITA™ 57.4 FMC+™ HSPC/HSPCe Loopback Card
Samtec's VITA™ 57.4 FMC+™ HSPC/HSPCe Loopback Card provides FPGA designers an easy to use loopback option for testing low-speed and high-speed multi-gigabit transceivers on any FPGA development board or FPGA carrier card. It can run system data or BER testing on all channels in parallel. This makes evaluation and development with an FPGA much easier and is an ideal substitute for 28 Gbps test equipment.
Part Number: REF-197693-01

FMC+™ HSPC Loopback Card
Samtec's VITA™ 57.4 FMC+™ HSPC Loopback Card provides FPGA designers an easy to use loopback option for testing low-speed and high-speed multi-gigabit transceivers on any FPGA development board or FPGA carrier card. It can run system data or BER testing on all channels in parallel. This makes evaluation and development with an FPGA much easier and is an ideal substitute for 28 Gbps test equipment.
Part Number: REF-197618-01

VITA™ 57.4 FMC+™ Extender Card
Engineers prototyping with industry-standard FPGA evaluation and development kits often leverage the FMC+™ interface for I/O expansion that fits their application needs. In some cases, the mating height of the standard FMC+™ connectors may prevent fully leveraging the connectivity options of all FMC+™ modules. In response to that need, Samtec has developed the FMC+™ Extender Card for placement between FPGA Carrier Cards and FMC+™ Modules. This increased space can be used for additional I/O expansion during development. The FMC+™ Extender Card also provides a cost-effective option for extending the life of the FPGA Carrier Card HSPC connectors used as test platforms.
Part Number: REF-212564-01

VITA™ 57.1 FMC™ Extender Card
Engineers prototyping with industry-standard FPGA evaluation and development kits often leverage the FMC interface for I/O expansion that fits their application needs. In some cases, the mating height of the standard FMC connectors may prevent fully leveraging the connectivity options of all FMC+ modules. In response to that need, Samtec has developed the FMC Extender Card (REF-228680-01) for placement between FPGA Carrier Cards and FMC Modules. This increased space can be used for additional I/O expansion during development. The FMC Extender Card also provides a cost-effective option for extending the life of the FPGA Carrier Card HPC connectors used as test platforms.
Part Number: REF-228680-01

Virtex® UltraScale+ FPGA VCU118
VCU118 FMC+™ HSPC Active Loopback Card: This loopback mezzanine card was designed to be used in conjunction with the Xilinx® UltraScale+ VCU118 Development board and is included in the VCU118 Development Kit available from Xilinx®. The mechanical design of the loopback card is based on an elongated version of the VITA™ 57.4 single width mezzanine card. This same loopback card is also available from Samtec as a standalone product to aid in FMC+™ development environments. This product is only available with Samtec's Flyover® QSFP28 Twinax Cable Assembly (HDR-193805-01-ECUE) and aluminum faceplate attached.
Part Number: REF-194194-03

Technical Data
Downloads & Resources
Literature
Technical Documents
Products
SEAF
Features
56 Gbps PAM4 performance
.050" (1.27 mm) pitch
Up to 500 I/Os
Rugged Edge Rate® contact
Current rating: 2.7 A max
Voltage rating: 240 VAC/ 339 VDC max
Stack heights from 7 mm to 18.5 mm
Lower insertion/withdrawal forces
Solder charge termination
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
Extended Life Product™ certified to 5,000 cycles and 150º operating temperature with SureCoat™ palladium nickel with gold flash plating. See E.L.P.™ test report.
Analog Over Array™ capable
SEAM
Features
56 Gbps PAM4 performance
.050" (1.27 mm) pitch
Up to 500 I/Os
Rugged Edge Rate® contact
Current rating: 2.7 A max
Voltage rating: 240 VAC/ 339 VDC max
Stack heights from 7 mm to 18.5 mm
Lower insertion/withdrawal forces
Solder charge termination
IPC-A-610F, acceptability of electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
IPC J-STD-001F, requirements for soldered electrical and electronic assemblies – meets class 3 acceptability criteria for high-performance/harsh environment electronic products
SET Qualified Product: visit samtec.com/SET for more information about Severe Environment Testing
Extended Life Product™ certified to 5,000 cycles and 150º operating temperature with SureCoat™ palladium nickel with gold flash plating. See E.L.P.™ test report.
Analog Over Array™ capable
SEAF-RA
Features
High-density open-pin-field array
Right-angle design
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Current rating: 1.9 A max
Voltage rating: 240 VAC/ 339 VDC max
Solder charge termination
Guide post, latching post options
Lower insertion/withdrawal forces
SEAM-RA
Features
High-density open-pin-field array
Right-angle design
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Current rating: 1.9 A max
Voltage rating: 240 VAC/ 339 VDC max
Solder charge terminations
Guide post, latching post options
Lower insertion/withdrawal forces
SEAMP
Features
High-density open-pin-field array
Press-fit tails
Rugged Edge Rate® contact
Current rating: 1.9 A max
Voltage rating: 255 VAC/361 VDC max
7 mm, 8 mm, 8.5 mm and 9.5 mm stacks
Lower insertion/withdrawal forces
SEAFP
Features
High-density open-pin-field array
Press-fit tails
Rugged Edge Rate® contact
Current rating: 1.9 A max
Voltage rating: 255 VAC/361 VDC max
7 mm to 16 mm stack heights
Lower insertion/withdrawal forces
SEAFP-RA
Features
Lower insertion/withdrawal forces
Rugged Edge Rate® contact
High-density open-pin-field array
Press-fit tails
Right-angle
SEAR
Features
85 ohm
Up to 40.00 mm stack
SEARAY™ riser
Current rating: 1.4 A max
Voltage rating: 240 VAC/ 339 VDC max
SEAMI
Features
85 ohm tuned
High-density open-pin-field array
Performance to 14 Gbps
JSO
Features
Works as a traditional standoff
Assists with unmating LSHM, SEAM/SEAF, SEAM8/SEAF8, LPAM/LPAF, ADM6/ADF6 and other high-normal-force connectors
Reduces risk for component damage on boards
Board stacks from 4.00 mm to 16.00 mm
Press-fit and threaded bases available
GPPK
Features
Accommodates blind mating in perpendicular applications
Mates with GPSK guide post socket
Pairs with most high-speed connector strips and arrays
GPSK
Features
Accommodates blind mating in perpendicular applications
Mates with GPPK Series guide post
Use with PCB thickness of .062" (1.60 mm) to .125" (3.18 mm)
Pairs with most high-speed connector strips and arrays
Contact Sales
More High-Density Arrays
- NovaRay® 128 Gbps PAM4, Extreme Density Arrays
- AcceleRate® HP High-Performance Arrays
- AcceleRate® HD Ultra-Dense, Slim Body Arrays
- AcceleRate® mP 0.635 mm Signal/Power Arrays
- Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems
- SEARAY™
- SEARAY™ 0.80 mm
- LP Array™
- SUPERNOVA™ Low Profile Compression Interposers
- HD Mezz
- E.L.P.™ High Mating Cycle Connectors
- Standoffs, Guide Posts & Ultra Rugged Hardware