These ultra high-density, high-speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.
The socket is also available in right-angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press-fit tails provide a high power option for greater system flexibility.
