Extreme Performance • Ultra-High Density • Design Flexibility
Samtec Flyover® cable technology can help extend signal reach and density to achieve next-gen speeds by routing signals via ultra-low skew twinax cable versus through lossy PCB.
As bandwidth requirements rapidly increase, Flyover® systems break the constraints of traditional signaling substrate and hardware offerings, resulting in a cost-effective, high-performance and heat efficient answer to the challenges of 224 Gbps bandwidths and beyond.
Fully integrated technology teams provide support to enable full system optimization from Silicon-to-Silicon™, including Samtec’s High-Speed Cable Plants.
THERMAL IMPROVEMENTS
Eye Speed® Cable Technology
Ideal for all high-performance applications up to 224+ Gbps PAM4 data rates
Flyover® SFP/QSFP/OSFP Cable Systems, Cages and Heat Sinks
These direct attach Flyover® SFP/QSFP/OSFP cable assemblies route critical high-speed signals through Eye Speed® ultra low skew twinax for improved and extended signal integrity.
Fully shielded, EMI protected I/O cable system using proven ExaMAX® technology with two reliable points of contact for 64 Gbps PAM4 (32 Gbps NRZ) performance in a cable-to-panel configuration.
Features
Fully shielded external cable and cage for EMI protection
Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch
AcceleRate® HP cable assembly is the industry’s highest density 112 Gbps PAM4 rated solution for near-chip cable-to-board applications or co-packaged (direct-to-chip package) solutions.
Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system or co-packaged (direct-to-chip package) solution
Near-chip solution overcomes the challenges of launching a high number of transmission lines off the board close to the chip (ARP6, APF6-L/APF6-T/APF6-S/APF6-RA-S)
Co-packaged (direct-to-chip package) solution offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (ART6, ATF6)
Eye Speed Thinax™ cable technology provides overall weight reduction and maximizes airflow, making it easy to route through systems; ultra low skew 3.5 ps/meter max
Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)
AcceleRate® is the industry's slimmest cable system with direct attach technology and ultra low skew twinax cable for 64 Gbps PAM4 (32 Gbps NRZ) speeds and PCIe® 6.0/CXL® 3.2 capable.
AcceleRate® Mini Extreme Performance, Mini Form Factor Cable System
AcceleRate® Mini Flyover® system delivers 112 Gbps PAM4 performance in an incredibly small form factor via Eye Speed Thinax™ ultra low skew twinax cable.
Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems
Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market. Electrically pluggable co-packaged copper and optics solutions (known as CPX) are achievable on a 95 mm x 95 mm or smaller substrate using Samtec's SFCM connector. The SFCM mounts directly to the package substrate and is pluggable with Samtec's SFCC cable assembly or an optical cable assembly of your choosing (contact HDR@samtec.com for more details).
Features
High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems
CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCM, SFCC, Optics)
Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)
Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications
High-density mezzanine arrays feature 64 differential pairs per square inch
Routes an extremely high number of transmission lines from one PCB to the next
Si-Fly® LP is Samtec's lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware with performance to 112 Gbps PAM4.
Features
Up to 16 pairs in an incredibly low 4.35 mm profile
Near-chip (ASIC-adjacent) cable system
Ideal for highly dense applications where z-axis height is limited
Samtec's FireFly™ Micro Flyover System™ embedded and rugged optical transceivers take data connection "off board" for up to 28 Gbps per lane with a path to 112 Gbps PAM4 via optical cable at greater distances, or copper for cost optimization.
Features
High-speed performance to 28 Gbps per lane
x4 and x12 designs
Interchangeability of copper and optical
Variety of integral heat sink and End 2 options
Micro rugged two-piece connector
Extended temperature and PCIe®-Over-Fiber solutions
IN DEVELOPMENT - Designed for next gen embedded applications demanding 56/112 Gbps PAM4 performance in low profile and ruggedized form factors.
Features
Halo® optical systems and Halo Cu™ copper systems are interchangeable using the same high-performance surface mount connector
Up to 16 channels and 112 Gbps PAM4 performance per lane
Protocol agnostic
Low profile designs for space savings
Designed to withstand high shock and vibration with a rugged 2-piece contact system
Supports data center, HPC and FPGA Protocols, including 10/40/100 (400/800 optics only) Gb Ethernet, InfiniBand™, Fibre Channel, PCIe®, CXL® and Aurora
Halo® socket connector features up to 76 pins in a single row around the perimeter for vertical mating with Halo® optical and and Halo Cu™ copper systems
Samtec Halo® optical transceiver kits and Halo Cu™ copper cables are not affiliated with HALO® front panel or other products sold by Halo Electronics (www.haloelectronics.com)
The ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).
Features
Enables 112 Gbps PAM4 electrical performance on a 2.00 mm column pitch
