AcceleRate® HP Extreme Density Cable System

Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system

Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE

0.635 mm contact pitch; 2.20 x 2.40 mm pitch row-to-row

34 AWG Eye Speed Thinax™ ultra low skew twinax cable, or 34 AWG Eye Speed ThinSE™ thin micro coax cable

Mixed differential pair and single-ended option available

Differential pair configuration: 8 or 12 pairs per row; 4 or 6 rows (8 rows on roadmap)

Single-ended coax configuration: 12 or 18 coax per row; dedicated G-S-G-S-G layout for reduced crosstalk

92 Ω differential pair and 50 Ω single-ended signal routing

Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)

View the full line of AcceleRate® products

Co-packaged (direct-to-chip package) solution

Routes an extremely high number of transmissions lines from the chip

112 Gbps PAM4 performance

Doubles the density in the same footprint compared to AcceleRate® HP near-chip cable system (ARP6, APF6-L/APF6-T)

12 rows, 6 or 12 pairs per row (72 and 144 differential pairs)

0.635 mm pitch with staggered row-to-row spacing

Eye Speed Thinax™ cable technology provides overall weight reduction and maximizes airflow

Ultra low skew 3.5 ps/meter max

2-piece system for high-reliability and thermal performance required for co-packaged solutions

Operating temperatures supporting -55 °C to +125 °C

Integrated mechanical retention (removal tool required) 

Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system

Designed to mate with AcceleRate® HP cable assembly (ARP6)

0.635 mm contact pitch; 2.20 x 2.40 mm pitch row-to-row

Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE

Rugged squeeze latch for quick disconnect

View the full line of AcceleRate® products

Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system

Designed to mate with AcceleRate® HP cable assembly (ARP6)

0.635 mm contact pitch; 2.20 x 2.40 mm pitch row-to-row

Data rate compatible with PCIe® 6.0/CXL® 3.1 and 100 GbE

Rugged locking for maximum density; removal tool required

View the full line of AcceleRate® products

Designed to mate with AcceleRate® HP Double Density cable assembly (ART6)

Co-packaged (direct-to-chip package) solution

112 Gbps PAM4 performance

Doubles the density in the same footprint compared to AcceleRate® HP near-chip cable system (ARP6, APF6-L/APF6-T)

12 rows, 6 or 12 pairs per row (72 and 144 differential pairs)

0.635 mm pitch with staggered row-to-row spacing

Surface mount reflow technology to the substrate

Qualified surface mount reflow processes; contact Samtec's Interconnect Processing Group

Operating temperatures supporting -55 °C to +125 °C

Integrated mechanical retention (removal tool required)