EYE SPEED® CABLE TECHNOLOGY

Samtec’s Eye Speed® cable technology supports extreme density and performance for next generation systems when used in conjunction with our high-performance connectors to create Flyover® solutions that provide signal integrity and thermal improvements.

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Overview


Eye Speed® Cable Technology includes 4 varieties: Samtec’s original ultra low skew Twinax with less than 3.5 ps/meter skew and perfect intra-pair sequencing, Thinax™ with a 40-percent smaller cross-sectional area, AIR™ with hyper low skew at 1.75 ps/meter, and ThinSE™ 50 Ohm micro coax with a small .024" outer cable diameter.

Eye Speed® Twinax

  • Ultra low skew: 3.5 ps/meter max
  • Ideal for 112 Gbps PAM4 applications: improved bandwidth and reach
  • Co-extruded: tight coupling between signal conductors
  • Impedance control and perfect intra-pair sequencing
  • Impedance (Ω): 92, 85 or 100

Eye Speed Thinax™

  • 40% smaller cross-sectional area versus Eye Speed® Twinax
  • Reduction in overall weight and maximizes air flow
  • Easy to route through systems
  • Ultra low skew: 3.5 ps/meter max
  • Impedance (Ω): 92

Eye Speed AIR™

  • Hyper low skew: 1.75 ps/meter max
  • Ideal for 224 Gbps PAM4 applications: improved bandwidth, reach and density
  • Uniformly foamed dielectric provides the lowest dK available
  • Insertion Loss: 14.3 dB (1m length at 56 GHz)
  • Easy to route through systems
  • 27 AWG Eye Speed AIR™ in development
  • Impedance (Ω): 92

Eye Speed ThinSE™

  • Small .024” outer diameter cable for 34 AWG variant
  • Min. bend radius: 0.125-inch (one-time bend)
  • Supports single-ended and mixed signaling (-DP & -SE) of Samtec high-performance cable assemblies
  • Impedance (Ω): 50

For dimensional or performance details by cable, view cable Data Sheets from our Technical Library: samtec.com/tech-library

All 4 Cable Types
flyover assemblies
Eye Speed® Cable Technology supports extreme density and performance for Samtec’s next generation of high-speed Flyover® cable assemblies.

Downloads & Resources


Literature

EyeSpeed eBrochure Cover

Eye Speed® Cable Technology eBrochure

Download PDF

Features


Cable Assemblies Using Eye Speed® Cable Technology
Family Series Differential Pair (-DP) Single Ended (-SE) Mixed Signaling
(-DP & -SE)
Ultra Low Skew Twinax Thinax™ AIR™ ThinSE™
AcceleRate® ARC6 ARC6 ARC6 ARC6 ARC6
AcceleRate® Mini ARM6 ARM6 ARM6 ARM6
AcceleRate® HP ARP6 ARP6 ARP6 ARP6
AcceleRate® HP Double Density ART6 ART6
Si-Fly® LP CPC CPC
Si-Fly® HD Co-Packaged SFCC SFCC
Si-Fly® HD Near-Chip SFNC SFNC
ExaMAX® EBCF EBCF EBCF EBCF
ExaMAX® EBCM EBCM EBCM EBCM
ExaMAX® I/O EBCE EBCE
Flyover® OSFP FOSFP FOSFP
Flyover® QSFP FQSFP FQSFP FQSFP
Flyover® QSFP Double Density 400 FQSFP-DD FQSFP-DD FQSFP-DD
Flyover® QSFP Double Density 800 FQSFP-D8 FQSFP-D8 FQSFP-D8
Flyover® SFP112 FSFP FSFP
NovaRay® I/O 38999 NVA3E NVA3E
NovaRay® I/O 38999 NVA3P NVA3P
NovaRay® NVAC NVAC NVAC NVAC
NovaRay® I/O NVACE NVACE NVACE NVACE NVACE
NovaRay® I/O NVACP NVACP NVACP NVACP NVACP
NovaRay® Backplane* NVCM NVCM NVCM
NovaRay® Backplane* NVCF NVCF NVCF

Released

In Development

*30 AWG power cable in development

Families



AcceleRate® Slim Direct Attach Cable Assemblies

AcceleRate® Slim Direct Attach Cable Assemblies

AcceleRate® is the industry's slimmest cable system with direct attach technology and ultra low skew twinax cable for 64 Gbps PAM4 (32 Gbps NRZ) speeds and PCIe® 6.0/CXL® 3.1 capable.

View the full line of AcceleRate® products.

Features
  • Incredibly slim 7.6 mm width

  • High-density 2-row design

  • Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

  • PCIe® 6.0/CXL® 3.1 capable

  • 8, 16 and 24 differential pair options available

  • 16 differential pair option can support PCIe® x4 plus sidebands

  • 24 differential pair option can support PCIe® x8 plus sidebands

  • 34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable

  • Improved signal integrity by eliminating transition board and its variability

  • Mating board level socket (ARF6 Series) features standard rugged weld tabs for increased stability on the PCB

  • Rugged metal latching and shielding

  • “Reversed Polarity” pinout option for reduced Far-End Crosstalk

  • View the full line of AcceleRate® products

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AcceleRate® Mini

AcceleRate® Mini Extreme Performance, Mini Form Factor Cable System

AcceleRate® Mini Flyover® system delivers 112 Gbps PAM4 performance in an incredibly small form factor via Eye Speed Thinax™ ultra low skew twinax cable.

View the full line of AcceleRate® products.

Features
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AcceleRate® HP Extreme Density Cable System

AcceleRate® HP Extreme Density Cable System

AcceleRate® HP cable assembly is the industry’s highest density 112 Gbps PAM4 rated solution for near-chip cable-to-board applications or co-packaged (direct-to-chip package) solutions.

View the full line of AcceleRate® products.

Features
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Si-Fly® LP 112 Gbps PAM4, Low Profile High-Density Cable Assembly

Si-Fly® LP 112 Gbps PAM4, Low Profile High-Density Cable Assembly

Si-Fly® LP is Samtec's lowest profile Flyover® cable solution capable of residing adjacent to the IC package, under heat sinks or other cooling hardware with performance to 112 Gbps PAM4.

Features
  • 25.6 TB aggregate, path to 51.2 TB

  • PCIe® 6.0/CXL® 3.1 capable

  • Ultra-high density

  • Uses direct connect technology to elude the BGA and route signals directly from the silicon package through a long-reach cable

  • 5x the reach of traditional PCB solutions

Product Family Image for Si-Fly™ 112 Gbps Low Profile Cable Assembly

Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems

Si-Fly® HD 224 Gbps PAM4, Co-Packaged & Near Chip Systems

Si-Fly® HD co-packaged and near-chip systems provide the highest density 224 Gbps PAM4 solution in today's market, with both vertical and right-angle cable launches.

Features
  • High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems

  • Co-packaged offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density

  • Eye Speed AIR™ cable technology provides the lowest dK possible using a uniformly foamed dielectric (33 AWG)

  • Hyper low skew: 1.75 ps/meter max

  • Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications


ExaMAX® High-Speed Backplane System

ExaMAX® High-Speed Backplane System

The ExaMAX® backplane system offers high-density and design flexibility to fit a variety of applications, including Flyover® cable supporting 112 Gbps PAM4 and board-to-board supporting 64 Gbps PAM4 (32 Gbps NRZ).

Features
  • Enables 112 Gbps PAM4 electrical performance on a 2.00 mm column pitch

  • PCIe® 6.0/CXL® 3.1 capable

  • Utilizes Samtec’s Eye Speed® ultra low skew twinax cable technology for improved signal integrity, increased flexibility and routability

  • 30 and 34 AWG to support various cable lengths

  • Two reliable points of contact with a 2.4 mm contact wipe

  • Highly customizable with modular flexibility

  • Reduce costs due to lower PCB layer counts

  • Wafer design increases isolation for reduced crosstalk; includes one sideband signal per column

  • 16 to 96 staggered differential pairs provide higher data rates

  • Lowest mating force on the market: 0.36 N max per contact

  • Stub free mating

  • Power and Guide Modules available

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ExaMAX® I/O

ExaMAX® I/O Shielded, High-Density Cable System

Fully shielded, EMI protected I/O cable system using proven ExaMAX® technology with two reliable points of contact for 64 Gbps PAM4 (32 Gbps NRZ) performance in a cable-to-panel configuration.

Features
  • Fully shielded external cable and cage for EMI protection

  • Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch

  • PCIe® 6.0/CXL® 3.1 capable

  • 24 to 72 pairs (4 and 6 pairs; 6, 8, 10 and 12 columns)

  • Single port cage designed for use with ExaMAX® right-angle board connector (EBTM-RA)

  • Rugged pull latch for mating/unmating

  • 30 and 34 AWG Eye Speed® ultra low skew twinax cable

  • Individual signal wafers with staggered differential pair design

  • One-piece embossed ground structure on each signal wafer to reduce crosstalk

  • Roadmap: cable-to-cable bulkhead panel connection for increased performance to 112 Gbps PAM4

Examax I/O Cable

Flyover® SFP/QSFP/OSFP Cable Systems

Flyover® SFP/QSFP/OSFP Cable Systems, Cages and Heat Sinks

These direct attach Flyover® SFP/QSFP/OSFP cable assemblies route critical high-speed signals through Eye Speed® ultra low skew twinax for improved and extended signal integrity.


NovaRay® I/O Panel Mount Cable System

NovaRay® I/O 112 Gbps PAM4 Panel Mount Cable System

NovaRay® I/O uses Flyover® cable technology to route up to 3,584 Gbps PAM4 aggregate data from the IC package to the panel and beyond.

Features
  • Highest aggregate data rate on the market - 3,584 Gbps PAM4

  • 16 & 32 diff pair configurations; accommodates PCIe® x4 or x8 plus sidebands

  • Cable-to-cable bulkhead panel connection using Flyover® cable technology

  • External Cable: 28 or 34 AWG twinax

  • Internal Cable: 34 AWG twinax

  • Single-Ended coax options also available

  • Full external EMI shielding

  • Multiple end 2 high-speed connector options available for your ASIC-adjacent Flyover® interconnect

  • Available in a threaded cable-to-panel design with a rugged 38999 shell for salt fog resistance to 48 hours and an IP67 sealed option (NVA3E/NVA3P)

NovaRay I/O Panel Mount Cable System

NovaRay® 112 Gbps PAM4, Extreme Density Arrays

NovaRay® 112 Gbps PAM4, Extreme Density Arrays

NovaRay® combines extreme density and performance for 112 Gbps PAM4 per channel in 40% less space than traditional arrays.


NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System

NovaRay® 112 Gbps PAM4 Micro Rugged Backplane System

NovaRay® Micro Rugged Backplane system combines ultra-high density with an offset footprint for optimal signal integrity performance to 112 Gbps PAM4.

Features
  • Ultra-high density with up to 128 differential pairs in a single connector

  • 56 Gbps NRZ/112 Gbps PAM4 performance per channel

  • Supports blind mate applications

  • Surface mount for better density and performance

  • Offset footprint for optimum signal integrity

  • Flyover® cable assembly in design

Product Family Image for NovaRay™ Backplane Cable

Halo™ Next Gen Mid-Board Optical Transceivers

Halo™ Next Gen Mid-Board Optical Transceivers

IN DEVELOPMENT - Designed for next gen embedded applications demanding 56/112 Gbps PAM4 performance in low profile and ruggedized form factors.

Features
  • Halo™ optical and copper systems are interchangeable using the same high-performance surface mount connector

  • Up to 16 channels and 112 Gbps PAM4 performance per lane

  • Protocol agnostic

  • Low profile designs for space savings

  • Designed to withstand high shock and vibration with a rugged 2-piece contact system

  • Supports data center, HPC and FPGA Protocols, including 10/40/100 (400/800 optics only) Gb Ethernet, InfiniBand™, Fibre Channel, PCIe®, CXL® and Aurora

  • Halo™ ring connector features up to 76 pins in a single row around the perimeter for vertical mating with optical and copper systems

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