Incredibly slim 7.6 mm width

High-density 2-row design

Supports 64 Gbps PAM4 (32 Gbps NRZ) applications

PCIe® 6.0/CXL® 3.2 capable

8, 16 and 24 differential pair options available

16 differential pair option can support PCIe® x4 plus sidebands

24 differential pair option can support PCIe® x8 plus sidebands

34 AWG, 100 Ω Eye Speed® ultra low skew twinax cable

Improved signal integrity by eliminating transition board and its variability

Mating board level socket (ARF6 Series) features standard rugged weld tabs for increased stability on the PCB

Rugged metal latching and shielding

“Reversed Polarity” pinout option for reduced Far-End Crosstalk

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112 Gbps PAM4 performance

34 AWG, 92 Ω Eye Speed Thinax™ ultra low skew twinax cable

One or two differential pairs

Vertical and right-angle mating board connector

Design flexibility as an End 2 option for Flyover® assemblies

Friction retention latching for a secure connection

Standard alignment pins

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Industry's highest density 112 Gbps PAM4 near-chip cable-to-board system or co-packaged (direct-to-chip package) solution

Near-chip solution overcomes the challenges of launching a high number of transmission lines off the board close to the chip (ARP6, APF6-L/APF6-T/APF6-S/APF6-RA-S)

Co-packaged (direct-to-chip package) solution offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (ART6, ATF6)

Data rate compatible with PCIe® 6.0/CXL® 3.2 and 100 GbE

32 to 96 differential pairs

4, 6 or 8 rows

34 AWG Eye Speed Thinax™ ultra low skew twinax cable, or 34 AWG Eye Speed ThinSE™ thin micro coax cable

Eye Speed Thinax™ cable technology provides overall weight reduction and maximizes airflow, making it easy to route through systems; ultra low skew 3.5 ps/meter max

Rugged squeeze latch for quick disconnect or locking tabs for maximum density (removal tool required)

Ideal for AI, high-performance computing (HPC) and data center applications

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Up to 16 pairs in an incredibly low 4.35 mm profile

Near-chip (ASIC-adjacent) cable system

Ideal for highly dense applications where z-axis height is limited

112 Gbps PAM4 performance per lane

PCIe® 6.0/CXL® 3.2 capable

Eludes the BGA and routes signals directly from the silicon package through a long-reach cable

High-density 224 Gbps PAM4 co-packaged and near-chip (ASIC adjacent) cable systems

CPX: electrically pluggable co-packaged copper & co-packaged optic high-density, high-performance interconnects on a 95 mm x 95 mm or smaller substrate (SFCM, SFCC, Optics)

Co-packaged CPX offers the lowest loss signal transmission from the package to the front panel or backplane while providing the highest density (use copper for short distances/scale up, optics for extended reach/scale out)

PCIe® 7.0 capable

Eye Speed® Hyper Low Skew Twinax cable technology supports 224G signaling with an industry leading 1.75 ps/m max intra-pair skew

Placement of Flyover® cable solutions on, or near, the chip package improves transmission line density and extends signal reach in high-performance applications

High-density mezzanine arrays feature 64 differential pairs per square inch

Routes an extremely high number of transmission lines from one PCB to the next

Surface mount reflow technology to the PCB

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Enables 112 Gbps PAM4 electrical performance on a 2.00 mm column pitch

PCIe® 6.0/CXL® 3.2 capable

Utilizes Samtec’s Eye Speed® ultra low skew twinax cable technology for improved signal integrity, increased flexibility and routability

30 and 34 AWG to support various cable lengths

Two reliable points of contact with a 2.4 mm contact wipe

Highly customizable with modular flexibility

Reduce costs due to lower PCB layer counts

Wafer design increases isolation for reduced crosstalk; includes one sideband signal per column

16 to 96 staggered differential pairs provide higher data rates

Lowest mating force on the market: 0.36 N max per contact

Stub free mating

Power and Guide Modules available

Fully shielded external cable and cage for EMI protection

Enables 64 Gbps PAM4 (32 Gbps NRZ) electrical performance on 2.00 mm column pitch

PCIe® 6.0/CXL® 3.2 capable

24 to 48 pairs (4 and 6 pairs; 6 and 8 columns)

Single port cage designed for use with ExaMAX® right-angle board connector (EBTM-RA)

Rugged pull latch for mating/unmating

30 and 34 AWG Eye Speed® ultra low skew twinax cable

Individual signal wafers with staggered differential pair design

One-piece embossed ground structure on each signal wafer to reduce crosstalk

Roadmap: cable-to-cable bulkhead panel connection for increased performance to 112 Gbps PAM4

4 or 8 channel systems

Eye Speed® 100 ohm twinax cable

PCIe® 6.0/CXL® 3.2 capable

Press-fit tails for low speed signals/power to PCB

No re-timers required for reduced cost and power consumption

Improved thermal dissipation by allowing ICs to be placed in preferred locations

Belly-to-belly mating for maximum density (FQSFP-DD Series)

Multiple end 2 options available

Compatible with all MSA QSFP pluggables

Highest aggregate data rate on the market - 4,096 Gbps PAM4

128 Gbps PAM4 per channel

PCIe® 7.0 capable

16 & 32 diff pair configurations; accommodates PCIe® x4 or x8 plus sidebands

Cable-to-cable bulkhead panel connection using Flyover® cable technology

External Cable: 28 or 34 AWG twinax

Internal Cable: 34 AWG twinax

Single-Ended coax options also available

Full external EMI shielding

Multiple end 2 high-speed connector options available for your ASIC-adjacent Flyover® interconnect

Available in a threaded cable-to-panel design with a rugged 38999 shell for salt fog resistance to 48 hours and an IP67 sealed option (NVA3E/NVA3P)

128 Gbps PAM4 per channel

PCIe® 7.0 capable

4.0 Tbps aggregate data rate - 9 IEEE 400G channels

Innovative, fully shielded differential pair design enables extremely low crosstalk (beyond 40 GHz) and tight impedance control

Two points of contact ensure a more reliable connection

92 Ω solution addresses both 85 Ω and 100 Ω applications

Analog Over Array™ capable

Ultra-high density with up to 128 differential pairs in a single connector

128 Gbps PAM4 performance per channel

PCIe® 7.0 capable

Supports blind mate applications

Surface mount for better density and performance

Offset footprint for optimum signal integrity

Flyover® cable assembly in design

Halo® optical systems and Halo Cu™ copper systems are interchangeable using the same high-performance surface mount connector

Up to 16 channels and 112 Gbps PAM4 performance per lane

Protocol agnostic

Low profile designs for space savings

Designed to withstand high shock and vibration with a rugged 2-piece contact system

Supports data center, HPC and FPGA Protocols, including 10/40/100 (400/800 optics only) Gb Ethernet, InfiniBand™, Fibre Channel, PCIe®, CXL® and Aurora

Halo® socket connector features up to 76 pins in a single row around the perimeter for vertical mating with Halo® optical and and Halo Cu™ copper systems

Samtec Halo® optical transceiver kits and Halo Cu™ copper cables are not affiliated with HALO® front panel or other products sold by Halo Electronics (www.haloelectronics.com)